Inventor · disambiguated record
Seung Hee Hong
Also filed as: HONG SEUNG HEE
45 granted patents·12 pending applications·160 citations·filing 2006–2022
97Inventor score
Files withHYNIX SEMICONDUCTOR INC16SAMSUNG ELECTRO MECH13SK HYNIX INC7KOREA KUMHO PETROCHEM CO LTD3CHEIL IND INC2
Top patents by PatentIndex Score
57 records- 0196US10395825B2Multilayer ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2018·Granted Aug 27, 2019·10 cites·12 claims
- 0295US9466603B2Semiconductor device with air gap and method for fabricating the sameSK HYNIX INC·Filed 2015·Granted Oct 11, 2016·11 cites·18 claims
- 0395US9293362B2Semiconductor device including air gaps and method of fabricating the sameSK HYNIX INC·Filed 2013·Granted Mar 22, 2016·21 cites·14 claims
- 0494US9202774B2Semiconductor device with air gap and method for fabricating the sameSK HYNIX INC·Filed 2013·Granted Dec 1, 2015·15 cites·19 claims
- 0594US9159609B2Semiconductor device with air gap spacer and capping barrier layer and method for fabricating the sameSK HYNIX INC·Filed 2013·Granted Oct 13, 2015·15 cites·8 claims
- 0693US9514980B2Semiconductor device with air gap and method for fabricating the sameSK HYNIX INC·Filed 2015·Granted Dec 6, 2016·8 cites·9 claims
- 0792US11217372B2Coil componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Jan 4, 2022·4 cites·20 claims
- 0890US11133126B2Coil componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Sep 28, 2021·4 cites·22 claims
- 0990US7682900B2Method of fabricating flash memory deviceHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Mar 23, 2010·16 cites·11 claims
- 1089US8822335B2Semiconductor device with air gap and method for fabricating the sameSK HYNIX INC·Filed 2013·Granted Sep 2, 2014·10 cites·18 claims
- 1184US11495391B2InductorSAMSUNG ELECTRO MECH·Filed 2019·Granted Nov 8, 2022·2 cites·17 claims
- 1280US10786209B2Monitoring system for strokeKOREA RES INST STANDARDS & SCI·Filed 2018·Granted Sep 29, 2020·6 cites·5 claims
- 1380US10690998B2Camera moduleSAMSUNG ELECTRO MECH·Filed 2019·Granted Jun 23, 2020·2 cites·18 claims
- 1479US7507628B2Method of manufacturing a non-volatile memory deviceHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Mar 24, 2009·9 cites·8 claims
- 1576US9665003B2Hardmask composition, method of forming patterns using the hardmask composition and semiconductor integrated circuit device including the patternsCHOI YOO-JEONG·Filed 2014·Granted May 30, 2017·3 cites·18 claims
- 1674US7504333B2Method of forming bit line of semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Mar 17, 2009·4 cites·22 claims
- 1771US10312074B2Method of producing layer structure, layer structure, and method of forming patternsSAMSUNG SDI CO LTD·Filed 2015·Granted Jun 4, 2019·2 cites·31 claims
- 1870US7713867B2Method for forming a metal line in a semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2008·Granted May 11, 2010·4 cites·25 claims
- 1969US8841218B2Resist underlayer composition and process of producing integrated circuit devices using sameHAN KWEN-WOO·Filed 2012·Granted Sep 23, 2014·2 cites·14 claims
- 2069US8314021B2Method for fabricating semiconductor device with buried gatesCHO JIK-HO·Filed 2010·Granted Nov 20, 2012·4 cites·20 claims
- 2167US7557033B2Method of forming metal line of semiconductor memory deviceHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Jul 7, 2009·2 cites·8 claims
- 2264US8163627B2Method of forming isolation layer of semiconductor deviceKIM JUNG GEUN·Filed 2007·Granted Apr 24, 2012·3 cites·19 claims
- 2362US10930427B2Coil componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Feb 23, 2021·0 cites·8 claims
- 2460US7560340B2Method of manufacturing flash memory deviceHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Jul 14, 2009·1 cites·8 claims
- 2559US8822617B2Copolymer for organic antireflective film, monomer, and composition comprising the copolymerLEE JIN HAN·Filed 2012·Granted Sep 2, 2014·1 cites·6 claims
- 2658US8748081B2Organic anti reflective layer compositionKOREA KUMHO PETROCHEM CO LTD·Filed 2012·Granted Jun 10, 2014·0 cites·9 claims
- 2758US2022285035A1Device and method of predicting disease by using elderly cohort dataELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2022·Application pending·0 cites
- 2855US10629373B2Thin film capacitorSAMSUNG ELECTRO MECH·Filed 2017·Granted Apr 21, 2020·0 cites·22 claims
- 2955US2010055408A1Organic anti-reflective layer composition containing ring-opened phthalic anhydride and method for preparation thereofKOREA KUMHO PETROCHEM CO LTD·Filed 2009·Application pending·0 cites
- 3054US11733538B2Camera moduleSAMSUNG ELECTRO MECH·Filed 2020·Granted Aug 22, 2023·0 cites·16 claims
- 3153US11294196B2Camera moduleSAMSUNG ELECTRO MECH·Filed 2020·Granted Apr 5, 2022·0 cites·18 claims
- 3253US8357482B2Organic anti-reflective layer composition containing ring-opened phthalic anhydride and method for preparation thereofKOREA KUMHO PETROCHEM CO LTD·Filed 2011·Granted Jan 22, 2013·0 cites·5 claims
- 3352US10796836B2InductorSAMSUNG ELECTRO MECH·Filed 2018·Granted Oct 6, 2020·0 cites·10 claims
- 3451US10726999B2Composite electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 28, 2020·0 cites·19 claims
- 3551US9362030B2Composition for forming silica based insulating layer, silica based insulating layer and method for manufacturing silica based insulating layerPARK EUN-SU·Filed 2014·Granted Jun 7, 2016·0 cites·8 claims
- 3651US8216932B2Method of manufacturing semiconductor devices having metal linesJEONG CHEOL MO·Filed 2008·Granted Jul 10, 2012·1 cites·11 claims
- 3750US11322285B2InductorSAMSUNG ELECTRO MECH·Filed 2019·Granted May 3, 2022·0 cites·20 claims
- 3850US9738787B2Composition for forming silica-based insulating layer, method for preparing composition for forming silica-based insulating layer, silica-based insulating layer, and method for manufacturing silica-based insulating layerCHEIL IND INC·Filed 2013·Granted Aug 22, 2017·0 cites·9 claims
- 3948US9890255B2Modified hydrogenated polysiloxazane, composition comprising same for forming silica-based insulation layer, method for preparing composition for formingCHEIL IND INC·Filed 2013·Granted Feb 13, 2018·0 cites·19 claims
- 4047US7517793B2Method of forming metal wire in semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Apr 14, 2009·0 cites·15 claims
- 4147US2016172304A1Semiconductor device including air gaps and method of fabricating the sameSK HYNIX INC·Filed 2016·Application pending·0 cites
- 4246US7462536B2Method of forming bit line of semiconductor memory deviceHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Dec 9, 2008·0 cites·13 claims
- 4346US2009098727A1Method of Forming Metal Line of Semiconductor DeviceHYNIX SEMICONDUCTOR INC·Filed 2008·Application pending·0 cites
- 4446US2009004856A1Method of forming contact plug in semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2007·Application pending·0 cites
- 4545US2009001583A1Method of manufacturing semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2008·Application pending·0 cites
- 4645US2019066905A1Coil component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Application pending·0 cites
- 4745US2009065940A1Metal wiring of a semiconductor device and method of forming the sameHYNIX SEMICONDUCTOR INC·Filed 2007·Application pending·0 cites
- 4844US7601632B2Method of forming a metal line of a semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Oct 13, 2009·0 cites·10 claims
- 4943US9574108B2Composition for forming silica based insulating layer, silica based insulating layer and method for manufacturing silica based insulating layerPARK EUN-SU·Filed 2014·Granted Feb 21, 2017·0 cites·11 claims
- 5043US2009029522A1Method of Forming Isolation Layer of Semiconductor DeviceHYNIX SEMICONDUCTOR INC·Filed 2007·Application pending·0 cites
Showing the top 50 of 57 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Seung Hee Hong files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →