Inventor · disambiguated record

Seok-Hwan Huh

Also filed as: HUH SEOK H · HUH SEOK-HWAN

1 granted patent·1 pending application·0 citations·filing 2006–2006

10Inventor score

Technology areasH10W

Files withSAMSUNG ELECTRO MECH2

Top patents by PatentIndex Score

2 records

0135US7592708B2Package board, semiconductor package, and fabricating method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted Sep 22, 2009·0 cites·22 claims
0235US2007126126A1Solder bonding structure using bridge type patternSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →