Inventor · disambiguated record
Seung-Tae Hwang
Also filed as: HWANG SEUNG-TAE
3 granted patents·4 citations·filing 2019–2021
56Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0183US11107743B2Chip on film package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 31, 2021·3 cites·16 claims
- 0266US10879225B2Semiconductor package and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 29, 2020·1 cites·22 claims
- 0363US11756850B2Chip on film package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →