Inventor · disambiguated record
Seiji Ichikawa
Also filed as: ICHIKAWA SEIJI
15 granted patents·415 citations·filing 1997–2008
94Inventor score
Top patents by PatentIndex Score
15 records- 0193US6104086ASemiconductor device having lead terminals bent in J-shapeNEC CORP·Filed 1998·Granted Aug 15, 2000·167 cites·6 claims
- 0276US7851884B2Field-effect transistor, semiconductor chip and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2008·Granted Dec 14, 2010·10 cites·26 claims
- 0373US6011303AElectronic componentNEC CORP·Filed 1997·Granted Jan 4, 2000·48 cites·20 claims
- 0473US5905301AMold package for sealing a chipNEC CORP·Filed 1997·Granted May 18, 1999·45 cites·16 claims
- 0563US6242797B1Semiconductor device having pellet mounted on radiating plate thereofNEC CORP·Filed 1998·Granted Jun 5, 2001·31 cites·10 claims
- 0658US6467666B2Method of producing a semiconductor deviceNEC CORP·Filed 2001·Granted Oct 22, 2002·10 cites·6 claims
- 0756US5889232AUltrahigh-frequency electronic componentNEC CORP·Filed 1997·Granted Mar 30, 1999·19 cites·1 claims
- 0850US5970322AUltrahigh-frequency electronic component and method of manufacturing the sameNEC CORP·Filed 1998·Granted Oct 19, 1999·15 cites·3 claims
- 0949US6175150B1Plastic-encapsulated semiconductor device and fabrication method thereofNEC CORP·Filed 1998·Granted Jan 16, 2001·18 cites·13 claims
- 1046US6319753B1Semiconductor device having lead terminals bent in J-shapeNEC CORP·Filed 1999·Granted Nov 20, 2001·12 cites·3 claims
- 1146US6150715ASemiconductor device with radiation plate for high radiation character and method of manufacturing the sameNEC CORP·Filed 1998·Granted Nov 21, 2000·14 cites·6 claims
- 1240US5904501AHollow package manufacturing methodNEC CORP·Filed 1997·Granted May 18, 1999·9 cites·7 claims
- 1337US6165818AMethod of manufacturing a semiconductor device with a pair of radiating terminals and a plurality of lead terminals formed from a single lead frameNEC CORP·Filed 1998·Granted Dec 26, 2000·7 cites·4 claims
- 1436US5956574ALead frame flash removing method and apparatusNEC CORP·Filed 1997·Granted Sep 21, 1999·7 cites·6 claims
- 1532US6177720B1Method of manufacturing a semiconductor device with a pair of radiating terminals and a plurality of lead terminals formed from a single lead frameNEC CORP·Filed 1999·Granted Jan 23, 2001·3 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →