Inventor · disambiguated record

Seungwon Im

Also filed as: IM SEUNGWON

38 granted patents·30 pending applications·43 citations·filing 2014–2025

96Inventor score

Technology areasH10W H01L

Files withSEMICONDUCTOR COMPONENTS IND LLC63 FAIRCHILD KR SEMICONDUCTOR LTD2 FAIRCHILD SEMICONDUCTOR2 FAIRCHILD KOREA SEMICONDUCTOR LTD1

Top patents by PatentIndex Score

68 records

0191US12368085B2Integration of semiconductor device assemblies with thermal dissipation mechanismsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Jul 22, 2025·1 cites·20 claims
0291US11984424B2Semiconductor packages using package in package systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted May 14, 2024·2 cites·20 claims
0391US11615967B2Power module package and method of manufacturing the sameSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Mar 28, 2023·2 cites·20 claims
0491US10403601B2Semiconductor package and related methodsFAIRCHILD SEMICONDUCTOR·Filed 2017·Granted Sep 3, 2019·7 cites·17 claims
0589US9130065B2Power module having stacked flip-chip and method for fabricating the power moduleFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2014·Granted Sep 8, 2015·8 cites·20 claims
0687US10090279B2Stray inductance reduction in packaged semiconductor devices and modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Oct 2, 2018·7 cites·20 claims
0787US2025140659A1Package including multiple semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
0883US11031379B2Stray inductance reduction in packaged semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jun 8, 2021·4 cites·20 claims
0982US12417999B2Semiconductor packages using package in package systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Sep 16, 2025·0 cites·20 claims
1081US11961782B2Integration of semiconductor device assemblies with thermal dissipation mechanismsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Apr 16, 2024·1 cites·15 claims
1181US11037907B2Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jun 15, 2021·2 cites·20 claims
1280US12142551B2Package including multiple semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
1380US11652030B2Power module and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted May 16, 2023·1 cites·18 claims
1479US11901309B2Semiconductor device package assemblies with direct leadframe attachmentSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Feb 13, 2024·2 cites·18 claims
1578US2024234246A1Integrated circuit direct cooling systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
1677US12315826B2Semiconductor device package assemblies with direct leadframe attachmentSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted May 27, 2025·0 cites·19 claims
1777US11145571B2Heat transfer for power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Oct 12, 2021·2 cites·20 claims
1877US10607919B2Semiconductor package having junction cooling pipes embedded in substratesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Mar 31, 2020·2 cites·14 claims
1977US2025349662A1Integration of semiconductor device assemblies with thermal dissipation mechanismsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
2076US2025125227A1Power module and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
2175US12211771B2Power module and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jan 28, 2025·0 cites·13 claims
2275US2025149512A1Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
2375US2025125297A1Submodule semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
2475US2025273646A1Dual cool power module with stress buffer layerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
2574US12300689B2Dual cool power module with stress buffer layerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted May 13, 2025·0 cites·18 claims
2674US11545421B2Package including multiple semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Jan 3, 2023·0 cites·20 claims
2774US10319670B2Package including multiple semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Jun 11, 2019·1 cites·18 claims
2872US12230606B2Semiconductor package and related methodsFAIRCHILD SEMICONDUCTOR·Filed 2021·Granted Feb 18, 2025·0 cites·20 claims
2971US12205918B2Submodule semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Jan 21, 2025·0 cites·20 claims
3071US11967540B2Integrated circuit direct cooling systems having substrates in contact with a cooling mediumSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Apr 23, 2024·0 cites·18 claims
3170USD1095474SPower module packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Granted Sep 30, 2025·0 cites·1 claims
3270US12230551B2Immersion direct cooling modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 18, 2025·0 cites·16 claims
3370US2025226284A1Thermal mismatch reduction in semiconductor device modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
3470US2024186211A1Direct-cooling for semiconductor device modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
3569US12476397B2Transfer molded power modules and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
3668US12230601B2High power module package structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 18, 2025·0 cites·20 claims
3767US12471204B2Semiconductor device modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Nov 11, 2025·0 cites·21 claims
3867US11201105B2Semiconductor package having a spacer with a junction cooling pipeSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Dec 14, 2021·0 cites·12 claims
3966US12272615B2Thermal mismatch reduction in semiconductor device modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Apr 8, 2025·0 cites·19 claims
4066US2025192097A1High power module package structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
4165US11658171B2Dual cool power module with stress buffer layerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted May 23, 2023·0 cites·16 claims
4264US11101198B2Semiconductor die package including a one-body clipSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Aug 24, 2021·0 cites·21 claims
4363US11004698B2Power module packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2014·Granted May 11, 2021·1 cites·18 claims
4463US10910297B2Package including multiple semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Feb 2, 2021·0 cites·20 claims
4563US2025149406A1Immersion direct cooling modules and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
4663US2022173022A1Clips for semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Application pending·0 cites
4762US2025372465A1Temperature sensing within an electronic componentSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
4860US11264311B2Clips for semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Mar 1, 2022·0 cites·20 claims
4960US2024194564A1Fluidic-channel cooled substratesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
5058US2024186218A1Molded power modules with fluidic-channel cooled substratesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites

Showing the top 50 of 68 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →