Inventor · disambiguated record
Seiji Izawa
Also filed as: IZAWA SEIJI
5 granted patents·19 citations·filing 2007–2022
70Inventor score
Top patents by PatentIndex Score
5 records- 0186US8242379B2Multilayered printed wiring board with a multilayered core substrateIKEDA TOMOYUKI·Filed 2007·Granted Aug 14, 2012·18 cites·18 claims
- 0265US8966750B2Method of manufacturing a multilayered printed wiring boardIKEDA TOMOYUKI·Filed 2011·Granted Mar 3, 2015·1 cites·17 claims
- 0359US11935801B2Electronic component built-in wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2022·Granted Mar 19, 2024·0 cites·20 claims
- 0453US11792937B2Component built-in wiring substrateIBIDEN CO LTD·Filed 2021·Granted Oct 17, 2023·0 cites·20 claims
- 0553US11437290B2Electronic component built-in wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2020·Granted Sep 6, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →