Inventor · disambiguated record
Seong Won Jeong
Also filed as: JEONG SEONG WON
9 granted patents·8 pending applications·67 citations·filing 1999–2024
83Inventor score
Files withDORCO CO LTD12SAMSUNG ELECTRONICS CO LTD2HYUNDAI MOTOR CO LTD1UNIV KOREA IND UNIV COOP FOUND1
Top patents by PatentIndex Score
17 records- 0192US11472053B2Razor blade and manufacturing method thereofDORCO CO LTD·Filed 2020·Granted Oct 18, 2022·3 cites·14 claims
- 0290US2025010504A1Razor blade and manufacturing method thereofDORCO CO LTD·Filed 2024·Application pending·0 cites
- 0389US12115692B2Razor blade and manufacturing method thereofDORCO CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·12 claims
- 0489US11858158B2Razor blade and manufacturing method thereofDORCO CO LTD·Filed 2022·Granted Jan 2, 2024·1 cites·18 claims
- 0586US6220251B1Combination vision enhancement kit and nail clipperFiled 1999·Granted Apr 24, 2001·62 cites·20 claims
- 0686US2024375304A1Razor blade and manufacturing method thereofDORCO CO LTD·Filed 2024·Application pending·0 cites
- 0783US12076873B2Razor blade and manufacturing method thereofDORCO CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·9 claims
- 0879US11559913B2Razor blade and manufacturing method thereofDORCO CO LTD·Filed 2020·Granted Jan 24, 2023·1 cites·16 claims
- 0963US2025153381A1Razor bladeDORCO CO LTD·Filed 2024·Application pending·0 cites
- 1063US2025153382A1Razor bladeDORCO CO LTD·Filed 2024·Application pending·0 cites
- 1160US2024300126A1Razor bladeDORCO CO LTD·Filed 2024·Application pending·0 cites
- 1260US2024246251A1Shaving bladeDORCO CO LTD·Filed 2024·Application pending·0 cites
- 1355US12424530B2Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 23, 2025·0 cites·11 claims
- 1453US11714484B2Method and system for interaction between VR application and controller capable of changing length and center of gravityUNIV KOREA IND UNIV COOP FOUND·Filed 2021·Granted Aug 1, 2023·0 cites·5 claims
- 1550US2023364818A1Razor blade having an asymmetrical edgeDORCO CO LTD·Filed 2021·Application pending·0 cites
- 1641US10347576B2Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 9, 2019·0 cites·20 claims
- 1740US2019202278A1Power transmission system of hybrid electric vehicleHYUNDAI MOTOR CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →