Inventor · disambiguated record
Seyoung Jeong
Also filed as: JEONG SEYOUNG
7 granted patents·4 pending applications·79 citations·filing 2011–2023
83Inventor score
Files withJEONG SEYOUNG3LEE HO JIN3CHOI EUN-KYOUNG2LG ENERGY SOLUTION LTD2SAMSUNG ELECTRONICS CO LTD1
Top patents by PatentIndex Score
11 records- 0195US8759147B2Semiconductor packages and methods of fabricating the sameCHOI EUN-KYOUNG·Filed 2011·Granted Jun 24, 2014·57 cites·18 claims
- 0284US8492902B2Multi-layer TSV insulation and methods of fabricating the sameLEE HO-JIN·Filed 2011·Granted Jul 23, 2013·8 cites·14 claims
- 0378US9153489B2Microelectronic devices having conductive through via electrodes insulated by gap regionsLEE HO-JIN·Filed 2012·Granted Oct 6, 2015·5 cites·20 claims
- 0473US9059072B2Semiconductor packages and methods of fabricating the sameCHOI EUN-KYOUNG·Filed 2014·Granted Jun 16, 2015·3 cites·4 claims
- 0569US8766455B2Stacked semiconductor devices and fabrication methods thereofJEONG SEYOUNG·Filed 2011·Granted Jul 1, 2014·3 cites·17 claims
- 0669US2025167277A1Jelly-Roll Type Electrode Assembly and Secondary Battery Comprising SameLG ENERGY SOLUTION LTD·Filed 2023·Application pending·0 cites
- 0768US9793165B2Methods of fabricating semiconductor devicesJEONG SEYOUNG·Filed 2012·Granted Oct 17, 2017·3 cites·10 claims
- 0862US2024363906A1Jelly-Roll Type Electrode Assembly and Secondary Battery Comprising SameLG ENERGY SOLUTION LTD·Filed 2023·Application pending·0 cites
- 0949US2014312505A1Semiconductor devices and fabrication methods thereofSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 1038US8933561B2Semiconductor device for semiconductor package having through silicon vias of different heightsJEONG SEYOUNG·Filed 2011·Granted Jan 13, 2015·0 cites·19 claims
- 1138US2012049349A1Semiconductor chips and methods of forming the sameLEE HO-JIN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →