Inventor · disambiguated record
Se-Young Jeong
Also filed as: JEONG SE-YOUNG
28 granted patents·25 pending applications·676 citations·filing 2004–2024
96Inventor score
Files withSAMSUNG ELECTRONICS CO LTD21JEONG SE-YOUNG7NTRIUM INC5LEE HO JIN3PUSAN NATIONAL UNIV INDUSTRIAL UNIV COOPERATION FOUNDATION3
Top patents by PatentIndex Score
53 records- 0197US8592991B2Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor deviceLEE HO-JIN·Filed 2011·Granted Nov 26, 2013·31 cites·30 claims
- 0297US7151009B2Method for manufacturing wafer level chip stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 19, 2006·356 cites·20 claims
- 0395US7015590B2Reinforced solder bump structure and method for forming a reinforced solder bumpSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Mar 21, 2006·119 cites·18 claims
- 0493US8592988B2Semiconductor deviceLEE HO-JIN·Filed 2011·Granted Nov 26, 2013·19 cites·11 claims
- 0592US9343361B2Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 17, 2016·11 cites·16 claims
- 0692US7271084B2Reinforced solder bump structure and method for forming a reinforced solder bumpSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 18, 2007·26 cites·42 claims
- 0790US9974215B1Electronic component package for electromagnetic interference shielding and method for manufacturing the sameNTRIUM INC·Filed 2016·Granted May 15, 2018·12 cites·2 claims
- 0889US9941196B2Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor deviceLEE HO JIN·Filed 2016·Granted Apr 10, 2018·5 cites·16 claims
- 0988US7307342B2Interconnection structure of integrated circuit chipSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 11, 2007·16 cites·19 claims
- 1087US7666690B2System, apparatus and method of selective laser repair for metal bumps of semiconductor device stackSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 23, 2010·8 cites·8 claims
- 1183US7119425B2Stacked multi-chip semiconductor package improving connection reliability of stacked chipsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 10, 2006·12 cites·24 claims
- 1274US7214604B2Method of fabricating ultra thin flip-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 8, 2007·17 cites·14 claims
- 1371US7338891B2Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 4, 2008·4 cites·6 claims
- 1471US7208842B2Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereofSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Apr 24, 2007·15 cites·14 claims
- 1570US2025323351A1Thermal runaway prevention film and method for manufacturing the sameNTRIUM INC·Filed 2024·Application pending·0 cites
- 1667US7524763B2Fabrication method of wafer level chip scale packagesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 28, 2009·4 cites·12 claims
- 1764US7732319B2Interconnection structure of integrated circuit chipSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 8, 2010·2 cites·16 claims
- 1862US7638365B2Stacked chip package and method for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 29, 2009·2 cites·29 claims
- 1961US7300864B2Method for forming solder bump structureSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Nov 27, 2007·9 cites·20 claims
- 2057US2025327167A1Silicon-coated antioxidant iron, silicon-coated antioxidant nickel, and manufacturing method thereforNAT UNIV PUSAN IND UNIV COOP FOUND·Filed 2023·Application pending·0 cites
- 2156US12386108B2Large-area single-crystal silver thin-film structure using single-crystal copper thin-film buffer layer and manufacturing method thereforNAT UNIV PUSAN IND UNIV COOP FOUND·Filed 2021·Granted Aug 12, 2025·0 cites·10 claims
- 2254US2006033118A1System, apparatus and method of selective laser repair for metal bumps of semiconductor device stackLEE KANG-WOOK·Filed 2005·Application pending·0 cites
- 2353US8663388B2Method of manufacturing single crystal wire and other single crystal metallic articlesJEONG SE YOUNG·Filed 2009·Granted Mar 4, 2014·0 cites·15 claims
- 2452US2025049830A1Pharmaceutical composition for preventing or treating cancer, comprising sglt-2 inhibitor and gossypolHAIM BIO LTD·Filed 2020·Application pending·0 cites
- 2552US2022105053A1Pharmaceutical composition for prevention or treatment of acidosisHAIM BIO CO LTD·Filed 2019·Application pending·0 cites
- 2652US2022125745A1Pharmaceutical composition for co-administration of acidosis-inducing drugHAIM BIO CO LTD·Filed 2019·Application pending·0 cites
- 2751US12180578B2RF sputtering apparatus for controlling atomic layer of thin filmPUSAN NATIONAL UNIV INDUSTRY—UNIV COOPERATION FOUNDATION·Filed 2021·Granted Dec 31, 2024·0 cites·5 claims
- 2851US7553751B2Method of forming solder bump with reduced surface defectsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 30, 2009·3 cites·5 claims
- 2951US2007205512A1Solder bump structure for flip chip package and method for manufacturing the sameLEE IN-YOUNG·Filed 2007·Application pending·0 cites
- 3050US11527488B2Semiconductor package and method for manufacturing the sameNTRIUM INC·Filed 2021·Granted Dec 13, 2022·0 cites·16 claims
- 3150US2007169857A1Single crystal wire and manufacturing method of the samePUSAN NAT UNIV IND COOP FOUND·Filed 2007·Application pending·0 cites
- 3249US10849258B2Electronic component package for electromagnetic interference shielding and method for manufacturing the sameNTRIUM INC·Filed 2018·Granted Nov 24, 2020·0 cites·5 claims
- 3348US2007200251A1Method of fabricating ultra thin flip-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3447US2015292113A1Metal single crystal in which metal element is substitutedBUSAN NAT UNIVERSITY IND UNIVERSITY COOPERATION FOUNDATION·Filed 2013·Application pending·0 cites
- 3547US2007200216A1Chip stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 3646US2010149640A1Tunable diffraction grating apparatusKOREA ELECTRONICS TELECOMM·Filed 2009·Application pending·0 cites
- 3745US7132358B2Method of forming solder bump with reduced surface defectsSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Nov 7, 2006·5 cites·15 claims
- 3844US10460852B2Electrode having nano mesh multi-layer structure, using single crystal copper, and manufacturing method thereforPUSAN NATIONAL UNIV INDUSTRIAL UNIV COOPERATION FOUNDATION·Filed 2015·Granted Oct 29, 2019·0 cites·9 claims
- 3944US2005127508A1Solder bump structure for flip chip package and method for manufacturing the sameFiled 2004·Application pending·0 cites
- 4042US2006289999A1Selective copper alloy interconnections in semiconductor devices and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 4141US2005104222A1Flip chip device having supportable bar and mounting structure thereofFiled 2004·Application pending·0 cites
- 4240US10512959B2Method for manufacturing single-crystalline metal ultrafine wirePUSAN NATIONAL UNIV INDUSTRIAL—UNIV COOPERATION FOUNDATION·Filed 2015·Granted Dec 24, 2019·0 cites·4 claims
- 4339US2017369986A1Method for preparing copper thin film by using single crystal copper targetPUSAN NATIONAL UNIV INDUSTRIAL UNIV COOPERATION FOUNDATION·Filed 2017·Application pending·0 cites
- 4439US2006202332A1Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 4538US2005282315A1High-reliability solder joint for printed circuit board and semiconductor package module using the sameJEONG SE-YOUNG·Filed 2005·Application pending·0 cites
- 4638US2011115078A1Flip chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
- 4737US8586477B2Semiconductor apparatus, method of manufacturing the same, and method of manufacturing semiconductor packageJEONG SE-YOUNG·Filed 2011·Granted Nov 19, 2013·0 cites·20 claims
- 4836US2012326307A1Stacked semiconductor deviceJEONG SE-YOUNG·Filed 2012·Application pending·0 cites
- 4936US2006073704A1Method of forming bump that may reduce possibility of losing contact pad materialJEONG SE-YOUNG·Filed 2005·Application pending·0 cites
- 5035US2006017161A1Semiconductor package having protective layer for re-routing lines and method of manufacturing the sameCHUNG JAE-SIK·Filed 2005·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →