Inventor · disambiguated record
Seung Hee Jo
Also filed as: JO SEUNG HEE
2 granted patents·5 pending applications·7 citations·filing 2009–2016
48Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0176US8592952B2Semiconductor chip and semiconductor package with stack chip structureJO SEUNG HEE·Filed 2011·Granted Nov 26, 2013·7 cites·15 claims
- 0250US2011031609A1Semiconductor package having through electrodes that reduce leakage current and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2009·Application pending·0 cites
- 0344US8609535B2Semiconductor package having through electrodes that reduce leakage current and method for manufacturing the sameJO SEUNG HEE·Filed 2011·Granted Dec 17, 2013·0 cites·18 claims
- 0431US2012129341A1Method for fabricating via hole and through-silicon viaJO SEUNG HEE·Filed 2011·Application pending·0 cites
- 0528US2013292818A1Semiconductor chip, semiconductor package having the same, and stacked semiconductor package using the semiconductor packageJO SEUNG HEE·Filed 2012·Application pending·0 cites
- 0626US2012273940A1Semiconductor apparatus and method for fabricating the sameJO SEUNG HEE·Filed 2011·Application pending·0 cites
- 0725US2017154868A1Semiconductor packagesSK HYNIX INC·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Seung Hee Jo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →