Inventor · disambiguated record
Seung Boo Jung
Also filed as: JUNG SEUNG BOO
5 granted patents·1 pending application·7 citations·filing 2008–2021
71Inventor score
Files withRES & BUSINESS FOUNDATION SUNGKYUNKWAN UNIV3RESEARCH & BUSINESS FOUND SUNGKYUNKWAN UNIV1SAMSUNG ELECTRONICS CO LTD1UNIV SUNGKYUNKWAN FOUND1
Top patents by PatentIndex Score
6 records- 0177USRE48421EFlip chip and method of making flip chipRES & BUSINESS FOUNDATION SUNGKYUNKWAN UNIV·Filed 2019·Granted Feb 2, 2021·3 cites·23 claims
- 0274USRE48422EMethod of making flip chipRES & BUSINESS FOUNDATION SUNGKYUNKWAN UNIV·Filed 2019·Granted Feb 2, 2021·3 cites·28 claims
- 0362USRE49286EMethod of making flip chipRES & BUSINESS FOUNDATION SUNGKYUNKWAN UNIV·Filed 2021·Granted Nov 8, 2022·0 cites·26 claims
- 0454US8048793B2Flip chip for electrical function test and manufacturing method thereofUNIV SUNGKYUNKWAN FOUND·Filed 2008·Granted Nov 1, 2011·1 cites·9 claims
- 0547US2009139758A1Printed circuit board assembly and manufacturing method for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0646US11094663B2Method for transient liquid-phase bonding between metal materials using a magnetic forceRESEARCH & BUSINESS FOUND SUNGKYUNKWAN UNIV·Filed 2020·Granted Aug 17, 2021·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →