Inventor · disambiguated record
Seokkan Ki
Also filed as: KI SEOKKAN
2 granted patents·3 pending applications·0 citations·filing 2021–2025
28Inventor score
Files withSAMSUNG ELECTRONICS CO LTD5
Top patents by PatentIndex Score
5 records- 0169US12243803B2Thermal interface material, method of manufacturing the same, and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Mar 4, 2025·0 cites·20 claims
- 0258US11935812B2Thermal interface material and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 19, 2024·0 cites·20 claims
- 0355US2025236775A1Composite structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0453US2025338449A1Electronic device including porous heat dissipation structureSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0552US2024170366A1Semiconductor package with a heat dissipation memberSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →