Inventor · disambiguated record
Se Ra Kim
Also filed as: KIM SE RA
40 granted patents·6 pending applications·138 citations·filing 2005–2025
96Inventor score
Top patents by PatentIndex Score
46 records- 0195US7285313B2Acrylic pressure-sensitive adhesive composition for polarizing filmLG CHEMICAL LTD·Filed 2005·Granted Oct 23, 2007·22 cites·6 claims
- 0292US7767752B2Acrylic pressure sensitive adhesive having antistatic propertyLG CHEMICAL LTD·Filed 2005·Granted Aug 3, 2010·12 cites·9 claims
- 0392US7462390B2Acrylic pressure-sensitive adhesive composition for polarizing filmLG CHEMICAL LTD·Filed 2005·Granted Dec 9, 2008·14 cites·10 claims
- 0491US8436122B2Pressure sensitive adhesive composition for transporting flexible substrateKHO DONG-HAN·Filed 2007·Granted May 7, 2013·22 cites·15 claims
- 0591US7309737B2Acrylic pressure sensitive adhesiveLG CHEMICAL LTD·Filed 2005·Granted Dec 18, 2007·12 cites·10 claims
- 0689US9482896B2Acrylic adhesive compositionKIM SE RA·Filed 2009·Granted Nov 1, 2016·8 cites·13 claims
- 0787US9798185B2Acrylic adhesive compositionLG CHEMICAL LTD·Filed 2013·Granted Oct 24, 2017·3 cites·14 claims
- 0885US7696278B2Acrylic pressure sensitive adhesive compositionsLG CHEMICAL LTD·Filed 2006·Granted Apr 13, 2010·7 cites·15 claims
- 0983US9953945B2Adhesive resin compostition for bonding semiconductors and adhesive film for semiconductorsLG CHEMICAL LTD·Filed 2015·Granted Apr 24, 2018·4 cites·20 claims
- 1082US10526513B2Composition for forming adhesive layer of dicing film, and dicing filmLG CHEMICAL LTD·Filed 2014·Granted Jan 7, 2020·2 cites·10 claims
- 1182US9868881B2Swelling tape for filling gapLG CHEMICAL LTD·Filed 2014·Granted Jan 16, 2018·1 cites·2 claims
- 1281US9761476B2Dicing film and dicing die-bonding filmLG CHEMICAL LTD·Filed 2014·Granted Sep 12, 2017·4 cites·15 claims
- 1381US7750075B2Acrylic pressure sensitive adhesive with good antistatic propertyLG CHEMICAL LTD·Filed 2005·Granted Jul 6, 2010·4 cites·11 claims
- 1475US9175193B2Adhesive sheet, manufacturing method thereof, optical filter and plasma display panelKIM WOO HA·Filed 2009·Granted Nov 3, 2015·3 cites·14 claims
- 1575US8717518B2Polarization plate and liquid crystal displayKIM SE RA·Filed 2009·Granted May 6, 2014·7 cites·15 claims
- 1672US9383481B2Liquid crystal displayKIM SE RA·Filed 2009·Granted Jul 5, 2016·2 cites·16 claims
- 1771US9236303B2Substrate film and method of manufacturing the sameLG CHEMICAL LTD·Filed 2013·Granted Jan 12, 2016·2 cites·24 claims
- 1869US9905450B2Wafer processing baseKIM SE RA·Filed 2011·Granted Feb 27, 2018·2 cites·9 claims
- 1969US9475961B2Swelling tape for filling gapLG CHEMICAL LTD·Filed 2013·Granted Oct 25, 2016·0 cites·7 claims
- 2069US7390900B2Silane coupling agent and method for manufacturing the sameLG CHEMICAL LTD·Filed 2005·Granted Jun 24, 2008·1 cites·8 claims
- 2167US10253223B2Semiconductor device and method for manufacturing the same using an adhesiveLG CHEMICAL LTD·Filed 2017·Granted Apr 9, 2019·1 cites·20 claims
- 2265US9862864B2Swelling tape for filling gapKIM SE RA·Filed 2013·Granted Jan 9, 2018·0 cites·6 claims
- 2364US2025157994A1Light-emitting diode filmO FLEX CO LTD·Filed 2024·Application pending·0 cites
- 2463US9663687B2Adhesive composition, protective film for a polarizing plate, polarizing plate, and liquid crystal displayKIM SE RA·Filed 2009·Granted May 30, 2017·0 cites·17 claims
- 2561US10991678B2Semiconductor device and method for manufacturing semiconductor deviceLG CHEMICAL LTD·Filed 2020·Granted Apr 27, 2021·0 cites·2 claims
- 2660US9499725B2Acrylic pressure-sensitive adhesive compositionsKIM SE RA·Filed 2008·Granted Nov 22, 2016·3 cites·5 claims
- 2759US10230084B2Swelling tape for filling gapLG CHEMICAL LTD·Filed 2013·Granted Mar 12, 2019·0 cites·13 claims
- 2858US9790408B2Polarizing plate having pressure sensitive adhesive layer with improved light leakage propertyKIM SE RA·Filed 2008·Granted Oct 17, 2017·2 cites·10 claims
- 2956US2025380999A1Surgical robotLIVSMED INC·Filed 2025·Application pending·0 cites
- 3054US10759971B2Adhesive composition for semiconductor, adhesive film for semiconductor, and dicing die bonding filmLG CHEMICAL LTD·Filed 2016·Granted Sep 1, 2020·0 cites·13 claims
- 3153US10865329B2Adhesive film for semiconductorLG CHEMICAL LTD·Filed 2016·Granted Dec 15, 2020·0 cites·16 claims
- 3252US2011139347A1Adhesive composition, adhesive sheet, and back grinding method for semiconductor waferLG CHEMICAL LTD·Filed 2009·Application pending·0 cites
- 3351US10844248B2Adhesive composition, adhesive sheet, and back grinding method for semiconductor waferLG CHEMICAL LTD·Filed 2017·Granted Nov 24, 2020·0 cites·18 claims
- 3450US10707187B2Semiconductor device and method for manufacturing semiconductor deviceLG CHEMICAL LTD·Filed 2016·Granted Jul 7, 2020·0 cites·5 claims
- 3547US11404301B2Dicing die-bonding filmLG CHEMICAL LTD·Filed 2018·Granted Aug 2, 2022·0 cites·8 claims
- 3647US9765232B2Solventless composition and method for preparing the sameLG CHEMICAL LTD·Filed 2013·Granted Sep 19, 2017·0 cites·17 claims
- 3747US9540547B2Composition for forming adhesive layer of dicing film, and dicing filmLG CHEMICAL LTD·Filed 2014·Granted Jan 10, 2017·0 cites·15 claims
- 3847US2011091676A1Pressure-sensitive adhesive film and back-grinding method using the sameLG CHEMICAL LTD·Filed 2009·Application pending·0 cites
- 3946US10640688B2Adhesive composition, protective film for a polarizing plate, polarizing plate, and liquid crystal displayLG CHEMICAL LTD·Filed 2017·Granted May 5, 2020·0 cites·11 claims
- 4045US9165815B2Wafer processing sheetKIM SE RA·Filed 2011·Granted Oct 20, 2015·0 cites·15 claims
- 4144US2012086892A1Adhesive compositionKIM SE RA·Filed 2011·Application pending·0 cites
- 4242US10338020B2Method for measuring metal ion permeability of polymer film and device for measuring metal ion permeability of polymer filmLG CHEMICAL LTD·Filed 2016·Granted Jul 2, 2019·0 cites·18 claims
- 4342US10324016B2Method for measuring metal ion permeability of polymer film and device for measuring metal ion permeability of polymer filmLG CHEMICAL LTD·Filed 2016·Granted Jun 18, 2019·0 cites·25 claims
- 4440US11021634B2Adhesive film, preparation method of semiconductor device, and semiconductor deviceLG CHEMICAL LTD·Filed 2016·Granted Jun 1, 2021·0 cites·13 claims
- 4540US10920109B2Semiconductor deviceLG CHEMICAL LTD·Filed 2017·Granted Feb 16, 2021·0 cites·14 claims
- 4637US2020369925A1Back grinding tapeLG CHEMICAL LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →