Inventor · disambiguated record
Seung Jee Kim
Also filed as: KIM SEUNG JEE
14 granted patents·3 pending applications·75 citations·filing 2009–2015
91Inventor score
Technology areasH10W
Top patents by PatentIndex Score
17 records- 0188US9064862B2Semiconductor chips having a dual-layered structure, packages having the same, and methods of fabricating the semiconductor chips and the packagesHWANG IN CHUL·Filed 2012·Granted Jun 23, 2015·9 cites·36 claims
- 0287US9345136B1Package substrates, semiconductor packages including the same, electronic systems including the same, and memory cards including the sameSK HYNIX INC·Filed 2015·Granted May 17, 2016·7 cites·22 claims
- 0386US8987900B2Embedded packages including a multi-layered dielectric layer and methods of manufacturing the sameKIM SEUNG JEE·Filed 2012·Granted Mar 24, 2015·9 cites·13 claims
- 0486US8390114B2Semiconductor packageKIM JAE MYUN·Filed 2010·Granted Mar 5, 2013·12 cites·12 claims
- 0584US9209146B2Electronic device packages having bumps and methods of manufacturing the sameSK HYNIX INC·Filed 2014·Granted Dec 8, 2015·6 cites·15 claims
- 0684US7989943B2Staircase shaped stacked semiconductor packageHYNIX SEMICONDUCTOR INC·Filed 2009·Granted Aug 2, 2011·15 cites·19 claims
- 0782US9324688B2Embedded packages having a connection joint groupSK HYNIX INC·Filed 2014·Granted Apr 26, 2016·6 cites·7 claims
- 0874US9153557B2Chip stack embedded packagesSK HYNIX INC·Filed 2014·Granted Oct 6, 2015·3 cites·19 claims
- 0972US9455235B2Thin embedded packages, methods of fabricating the same, electronic systems including the same, and memory cards including the sameSK HYNIX INC·Filed 2014·Granted Sep 27, 2016·3 cites·16 claims
- 1069US8492889B2Semiconductor packageSK HYNIX INC·Filed 2013·Granted Jul 23, 2013·2 cites·18 claims
- 1166US8907487B2Electronic device packages having bumps and methods of manufacturing the sameKIM SEUNG JEE·Filed 2012·Granted Dec 9, 2014·2 cites·5 claims
- 1263US9209150B2Embedded packages, methods of fabricating the same, electronic systems including the same, and memory cards including the sameSK HYNIX INC·Filed 2013·Granted Dec 8, 2015·1 cites·16 claims
- 1349US9263417B2Semiconductor packages including a multi-layered dielectric layer and methods of manufacturing the sameSK HYNIX INC·Filed 2015·Granted Feb 16, 2016·0 cites·9 claims
- 1448US9252136B2Package stacked deviceSK HYNIX INC·Filed 2014·Granted Feb 2, 2016·0 cites·20 claims
- 1545US2015249075A1Semiconductor chips having a dual-layered structure, packages having the same, and methods of fabricating the semiconductor chips and the packagesSK HYNIX INC·Filed 2015·Application pending·0 cites
- 1641US2013334685A1Embedded packages and methods of manufacturing the sameKIM SI HAN·Filed 2012·Application pending·0 cites
- 1741US2014167276A1Substrate for semiconductor package, semiconductor package using the substrate, and method of manufacturing the semiconductor packageSK HYNIX INC·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →