Inventor · disambiguated record
Seok Ho Kim
Also filed as: KIM SEOK · KIM SEOK H · KIM SEOK-HO
44 granted patents·15 pending applications·725 citations·filing 1993–2024
97Inventor score
Files withSAMSUNG ELECTRONICS CO LTD25KIM SEOK HO3NAM GUENG HYUN3COMBASIS TECHNOLOGY INC2GLOBAL BATTERY CO LTD2
Top patents by PatentIndex Score
59 records- 0198US9941243B2Wafer-to-wafer bonding structureSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 10, 2018·237 cites·20 claims
- 0296US12170259B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 17, 2024·4 cites·20 claims
- 0396US9865581B2Method of fabricating multi-substrate semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 9, 2018·25 cites·20 claims
- 0496US9520361B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 13, 2016·28 cites·20 claims
- 0594US9935037B2Multi-stacked device having TSV structureSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 3, 2018·13 cites·20 claims
- 0693US10639875B2Wafer bonding apparatus and wafer bonding system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 5, 2020·6 cites·20 claims
- 0793US5781540ADevice and method for communicating in a mobile satellite systemHUGHES AIRCRAFT CO·Filed 1995·Granted Jul 14, 1998·180 cites·21 claims
- 0892US10468400B2Method of manufacturing substrate structureSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 5, 2019·8 cites·19 claims
- 0989US7479874B2Verification of singulated RFID tags by RFID readersSYMBOL TECHNOLOGIES INC·Filed 2006·Granted Jan 20, 2009·25 cites·23 claims
- 1087US10325897B2Method for fabricating substrate structure and substrate structure fabricated by using the methodSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 18, 2019·4 cites·20 claims
- 1179USD695682SBattery packNAM GUENG HYUN·Filed 2012·Granted Dec 17, 2013·28 cites·1 claims
- 1279US8088648B2Method of manufacturing a chip stack packageJO CHA-JEA·Filed 2010·Granted Jan 3, 2012·6 cites·15 claims
- 1378US6996767B2Memory configuration scheme enabling parallel decoding of turbo codesCOMBASIS TECHNOLOGY INC·Filed 2002·Granted Feb 7, 2006·27 cites·5 claims
- 1477US9287251B2Method of manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 15, 2016·3 cites·20 claims
- 1577US8175386B2Image acquiring apparatus and control method thereofKIM SEOK-HO·Filed 2008·Granted May 8, 2012·6 cites·17 claims
- 1676US5455964AStabilization of frequency and power in an airborne communication systemCLAIRCOM COMMUNICATIONS GROUP·Filed 1993·Granted Oct 3, 1995·66 cites·34 claims
- 1775US2025054891A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1870US10763243B2Substrate bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 1, 2020·1 cites·18 claims
- 1970US8431479B2Semiconductor devices having redistribution structures and packages, and methods of forming the sameKIM KI-HYUK·Filed 2010·Granted Apr 30, 2013·4 cites·23 claims
- 2065US7612292B1Current lead using rutherford cableKOREA ELECTROTECH RES INST·Filed 2008·Granted Nov 3, 2009·5 cites·10 claims
- 2164US8569212B2Superconducting wireHA HONG SOO·Filed 2011·Granted Oct 29, 2013·2 cites·5 claims
- 2264US8193637B2Semiconductor package and multi-chip package using the samePARK MYEONG-SOON·Filed 2008·Granted Jun 5, 2012·4 cites·25 claims
- 2364US2025265702A1Measurement position monitoring apparatus and semiconductor manufacturing equipment including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2461US11283235B2Semiconductor laser deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 22, 2022·0 cites·20 claims
- 2561US9385730B2Phase-rotating phase locked loop and method of controlling operation thereofSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 5, 2016·1 cites·16 claims
- 2660US11655306B2NK cell-activating fusion protein, NK cell, and pharmaceutical composition including sameKOREA RES INST BIOSCIENCE & BIOTECHNOLOGY·Filed 2018·Granted May 23, 2023·0 cites·13 claims
- 2760US2008157287A1Semiconductor devices and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2859US9654118B2Phase-rotating phase locked loop and method of controlling operation thereofSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 16, 2017·1 cites·4 claims
- 2959US9240579B2Battery cell case with holderNAM GUENG HYUN·Filed 2012·Granted Jan 19, 2016·0 cites·7 claims
- 3059US2024339420A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3158US9559344B2Lithium batteryGLOBAL BATTERY CO LTD·Filed 2015·Granted Jan 31, 2017·0 cites·11 claims
- 3257US10770447B2Method for fabricating substrate structure and substrate structure fabricated by using the methodSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 8, 2020·0 cites·20 claims
- 3357US9935298B2Battery cell case having front case plate seated into rear case plateGLOBAL BATTERY CO LTD·Filed 2015·Granted Apr 3, 2018·0 cites·12 claims
- 3457US9425442B2Lithium batteryNAM GUENG HYUN·Filed 2012·Granted Aug 23, 2016·0 cites·12 claims
- 3557US8514150B2Plasma display apparatusKIM SEOK HO·Filed 2009·Granted Aug 20, 2013·0 cites·17 claims
- 3656US9656502B2Method for fabricating transfer printing substrate using concave-convex structure, transfer printing substrate fabricated thereby and application thereofGWANGJU INST SCIENCE & TECH·Filed 2015·Granted May 23, 2017·0 cites·5 claims
- 3756US2024006362A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3855US5974092AMethod and system for mobile alerting in a communication systemHUGHES ELECTRONICS CORP·Filed 1995·Granted Oct 26, 1999·26 cites·19 claims
- 3954US8390608B2Plasma display apparatusPARK DONG HYUN·Filed 2009·Granted Mar 5, 2013·0 cites·20 claims
- 4052US6950975B2Acceleration of convergence rate with verified bits in turbo decodingCOMBASIS TECHNOLOGY INC·Filed 2002·Granted Sep 27, 2005·11 cites·3 claims
- 4151US2023400266A1Apparatus for high temperature gas, including three-dimensional lattice structure, and method for manufacturing sameNAT UNIV CHANGWON IND ACADEMY COOP CORPS·Filed 2021·Application pending·0 cites
- 4251US2008230923A1Chip stack package and method of manufacturing the chip stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 4350US2010045653A1Plasma display devicePARK DONG HYUN·Filed 2009·Application pending·0 cites
- 4448US11417536B2Method for wafer planarization and an image sensor made by the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 16, 2022·0 cites·18 claims
- 4547US9005709B2Method for fabricating transfer printing substrate using concave-convex structure, transfer printing substrate fabricated thereby and application thereofKWANGJU INST SCI & TECH·Filed 2012·Granted Apr 14, 2015·0 cites·20 claims
- 4647US2005133140A1Steel cord having ultrafine steel filaments to reinforce tire carcass and radial tire for passenger car using the sameHONGDUK STEEL CORD CO LTD AND·Filed 2004·Application pending·0 cites
- 4746US11728200B2Wafer bonding apparatusesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 15, 2023·0 cites·20 claims
- 4846US2007057872A1Plasma display apparatus and driving method of the sameLG ELECTRONICS INC·Filed 2006·Application pending·0 cites
- 4946US2008157332A1Stacked semiconductor packages and methods of manufacturing stacked semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 5046US2007091025A1Method of driving plasma display apparatusLG ELECTRONICS INC·Filed 2006·Application pending·0 cites
Showing the top 50 of 59 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →