Inventor · disambiguated record
Seokbong Kim
Also filed as: KIM SEOKBONG
8 granted patents·3 pending applications·83 citations·filing 2009–2024
83Inventor score
Files withADVANCED SEMICONDUCTOR ENG KOREA INC5ADVANCED SEMICONDUCTOR ENG3SEMICONDUCTOR COMPONENTS IND LLC2HAN INGYU1
Top patents by PatentIndex Score
11 records- 0189US8030750B2Semiconductor device packages with electromagnetic interference shieldingADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Oct 4, 2011·44 cites·19 claims
- 0288US8368185B2Semiconductor device packages with electromagnetic interference shieldingADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Feb 5, 2013·26 cites·20 claims
- 0380US11495531B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG KOREA INC·Filed 2020·Granted Nov 8, 2022·2 cites·19 claims
- 0475US10622318B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG KOREA INC·Filed 2017·Granted Apr 14, 2020·3 cites·20 claims
- 0575US8178961B2Semiconductor package structure and package processHAN INGYU·Filed 2010·Granted May 15, 2012·8 cites·14 claims
- 0659US2025329610A1Fluid-cooled power moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0756US2025105200A1Power module structure with clip substrate memberSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 0848US11776917B2Electronic packageADVANCED SEMICONDUCTOR ENG KOREA INC·Filed 2020·Granted Oct 3, 2023·0 cites·5 claims
- 0938US10388586B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG KOREA INC·Filed 2017·Granted Aug 20, 2019·0 cites·21 claims
- 1033US2011163430A1Leadframe Structure, Advanced Quad Flat No Lead Package Structure Using the Same, and Manufacturing Methods ThereofADVANCED SEMICONDUCTOR ENG·Filed 2010·Application pending·0 cites
- 1131US10854556B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG KOREA INC·Filed 2016·Granted Dec 1, 2020·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →