Inventor · disambiguated record
Seokho Kim
Also filed as: KIM SEOKHO
25 granted patents·11 pending applications·40 citations·filing 2009–2025
93Inventor score
Files withSAMSUNG ELECTRONICS CO LTD27HUGHES NETWORK SYSTEMS LLC3KIM KYOUNGRAN1KIM TAEYEONG1LEE HO JIN1
Top patents by PatentIndex Score
36 records- 0197US11380607B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 5, 2022·4 cites·20 claims
- 0296US11749587B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 5, 2023·3 cites·20 claims
- 0393US10923452B2Substrate bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 16, 2021·7 cites·20 claims
- 0492US12142588B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 12, 2024·1 cites·19 claims
- 0590US11362067B2Methods of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 14, 2022·3 cites·20 claims
- 0689US9653430B2Semiconductor devices having stacked structures and methods for fabricating the sameKIM TAEYEONG·Filed 2015·Granted May 16, 2017·14 cites·20 claims
- 0783US2025038141A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0881US12334477B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 0981US2025293212A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1079US11348892B2Semiconductor devices including bonding layer and adsorption layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 31, 2022·1 cites·19 claims
- 1177US8564139B2Semiconductor devices including protected barrier layersLEE HO-JIN·Filed 2012·Granted Oct 22, 2013·4 cites·18 claims
- 1274US11616036B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 28, 2023·0 cites·20 claims
- 1372US10694479B2Timing synchronization with a modified DVB-S2X waveform for a beam hopping satelliteREGUNATHAN MURALI·Filed 2018·Granted Jun 23, 2020·2 cites·18 claims
- 1471US11887966B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·20 claims
- 1569US12470341B2VSAT demodulator architecture for beam hopping satellite systemsHUGHES NETWORK SYSTEMS LLC·Filed 2022·Granted Nov 11, 2025·0 cites·23 claims
- 1668US11296045B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 5, 2022·0 cites·18 claims
- 1767US10109665B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 23, 2018·1 cites·15 claims
- 1865US11824035B2Method of manufacturing a semiconductor device including bonding layer and adsorption layerSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 21, 2023·0 cites·18 claims
- 1957US2024243102A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2057US2024312935A1Bonding semiconductor device, and chip for bonding semiconductor device and manufacturing method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2156US2024038708A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2256US2024274593A1Semiconductor device and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2354US12374944B2Rotor for a rotating electric machine including end plates and fixing portionsMITSUBISHI ELECTRIC CORP·Filed 2023·Granted Jul 29, 2025·0 cites·9 claims
- 2453US2022084199A1Method for analyzing biomaterials based on image analysis and personalization dataSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 2553US2024030083A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2652US12500189B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 16, 2025·0 cites·19 claims
- 2750US11658139B2Semiconductor package for improving bonding reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 2849US2023178345A1Method of cleaning chamberKIM KYOUNGRAN·Filed 2022·Application pending·0 cites
- 2948US11887841B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·12 claims
- 3047US11728197B2Wafer to wafer bonding apparatus and wafer to wafer bonding methodSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·19 claims
- 3147US10097259B2Satellite receiver doppler compensation using resampled satellite signalsHUGHES NETWORK SYSTEMS LLC·Filed 2014·Granted Oct 9, 2018·0 cites·20 claims
- 3247US8344967B2Plasma display apparatusLG ELECTRONICS INC·Filed 2009·Granted Jan 1, 2013·0 cites·8 claims
- 3345US2022376870A1Demodulator implementation that supports both non-vlsnr and vlsnr downlink frames present in a single streamHUGHES NETWORK SYSTEMS LLC·Filed 2021·Application pending·0 cites
- 3444US12278251B2Image sensorSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 15, 2025·0 cites·20 claims
- 3543US10411062B2Substrate bonding apparatus having adsorption sectors with different vacuum pressures and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 10, 2019·0 cites·13 claims
- 3632US2010190333A1Method of forming connection terminalSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →