Inventor · disambiguated record
Se Hyun Ko
Also filed as: KO SE HYUN
5 granted patents·2 pending applications·18 citations·filing 2012–2022
73Inventor score
Top patents by PatentIndex Score
7 records- 0184US9663847B2High thermal conductivity Al—Mg—Fe—Si alloy for die castingKOREA IND TECH INST·Filed 2012·Granted May 30, 2017·3 cites·3 claims
- 0278USD972580SDisplay panel with a graphical user interfaceLINE PLUS CORP·Filed 2020·Granted Dec 13, 2022·8 cites·1 claims
- 0376USD1001820SDisplay panel with a graphical user interfaceLINE PLUS CORP·Filed 2020·Granted Oct 17, 2023·7 cites·1 claims
- 0467US11935172B2Method, system, and non-transitory computer readable record medium for expressing emotion in conversation message using gestureLINE PLUS CORP·Filed 2022·Granted Mar 19, 2024·0 cites·17 claims
- 0557US11538212B2Method, system, and non-transitory computer readable record medium for expressing emotion in conversation message using gestureLINE PLUS CORP·Filed 2020·Granted Dec 27, 2022·0 cites·18 claims
- 0646US2014234159A1HIGH THERMAL CONDUCTIVITY Al-Si-Fe-Zn ALLOY FOR DIE CASTINGKOREA IND TECH INST·Filed 2012·Application pending·0 cites
- 0744US2015218678A1Al-zn alloy for die casting having both high strength and high thermal conductivityKOREA IND TECH INST·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →