Inventor · disambiguated record
Seiji Kurashina
Also filed as: KURASHINA SEIJI
9 granted patents·6 pending applications·46 citations·filing 1997–2016
86Inventor score
Top patents by PatentIndex Score
15 records- 0185US8525323B2Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating packageYAMAZAKI TAKAO·Filed 2009·Granted Sep 3, 2013·12 cites·21 claims
- 0276US7795585B2Vacuum package and manufacturing process thereofNEC CORP·Filed 2008·Granted Sep 14, 2010·7 cites·10 claims
- 0375US8618483B2Bolometer type Terahertz wave detectorKURASHINA SEIJI·Filed 2011·Granted Dec 31, 2013·4 cites·6 claims
- 0475US7276698B2Thermal-type infra-red ray solid-state image sensor and method of fabricating the sameNEC CORP·Filed 2005·Granted Oct 2, 2007·7 cites·23 claims
- 0574US9157805B2Infrared ray sensor package, infrared ray sensor module, and electronic deviceNEC CORP·Filed 2013·Granted Oct 13, 2015·3 cites·17 claims
- 0663US8541742B2Bolometer-type THz wave detectorKURASHINA SEIJI·Filed 2012·Granted Sep 24, 2013·2 cites·6 claims
- 0756US7781030B2Infrared sensor manufacturing method suitable for mass productionNAT INST OF ADVANCED IND SCIEN·Filed 2007·Granted Aug 24, 2010·2 cites·10 claims
- 0853US8215832B2Infrared sensor and manufacturing method thereofKURASHINA SEIJI·Filed 2009·Granted Jul 10, 2012·2 cites·6 claims
- 0950US2014022718A1Vacuum sealed package, printed circuit board having vacuum sealed package, electronic device, and method for manufacturing vacuum sealed packageYAMAZAKI TAKAO·Filed 2013·Application pending·0 cites
- 1044US2012106085A1Vacuum sealed package, printed circuit board having vacuum sealed package, electronic device, and method for manufacturing vacuum sealed packageYAMAZAKI TAKAO·Filed 2010·Application pending·0 cites
- 1143US6137663AMagnetic head and method for magnetic recording and playbackNEC CORP·Filed 1997·Granted Oct 24, 2000·7 cites·10 claims
- 1243US2010276593A1Infrared sensor manufactured by method suitable for mass productionNEC CORP·Filed 2010·Application pending·0 cites
- 1342US2005116169A1Thermal-type infra-red ray solid-state image sensor and method of fabricating the sameNEC CORP·Filed 2004·Application pending·0 cites
- 1434US2016238453A1Infrared sensor manufactured by method suitable for mass productionMIZUTA YURIKO·Filed 2016·Application pending·0 cites
- 1532US2017030775A1Terahertz-wave detectorNEC CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →