Inventor · disambiguated record
Seung-Mahn Lee
Also filed as: LEE SEUNG-MAHN
2 granted patents·1 pending application·87 citations·filing 2002–2006
68Inventor score
Top patents by PatentIndex Score
3 records- 0191US7737038B2Method of fabricating semiconductor device including planarizing conductive layer using parameters of pattern density and depth of trenchesSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 15, 2010·48 cites·19 claims
- 0286US6821309B2Chemical-mechanical polishing slurry for polishing of copper or silver filmsUNIV FLORIDA·Filed 2002·Granted Nov 23, 2004·39 cites·23 claims
- 0332US2003168627A1Slurry and method for chemical mechanical polishing of metal structures including refractory metal based barrier layersFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →