Inventor · disambiguated record

Seokkyu Lee

Also filed as: LEE SEOKKYU

0 granted patents·3 pending applications·0 citations·filing 2023–2024

Technology areasH10W

Files withSAMSUNG ELECTRONICS CO LTD3

Top patents by PatentIndex Score

3 records

0158US2025132202A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
0256US2025140727A1Wiring structure, semiconductor package comprising the same, and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
0352US2024194582A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →