Inventor · disambiguated record
Seungyoung Lee
Also filed as: LEE SEUNGYOUNG
22 granted patents·14 pending applications·48 citations·filing 2012–2024
93Inventor score
Top patents by PatentIndex Score
36 records- 0197US11222831B2Stacked integrated circuit devicesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 11, 2022·4 cites·20 claims
- 0294US11699636B2Stacked integrated circuit devicesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 11, 2023·2 cites·9 claims
- 0393US10505546B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 10, 2019·9 cites·20 claims
- 0491US9773772B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 26, 2017·8 cites·13 claims
- 0588US10622999B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 14, 2020·4 cites·18 claims
- 0687US11302636B2Semiconductor device and manufacturing method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 12, 2022·2 cites·17 claims
- 0786US12341085B2Stacked integrated circuit devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jun 24, 2025·0 cites·20 claims
- 0886US10026688B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 17, 2018·4 cites·20 claims
- 0985US9929023B2Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 27, 2018·3 cites·20 claims
- 1084US10541243B2Semiconductor device including a gate electrode and a conductive structureSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 21, 2020·4 cites·15 claims
- 1181US9646960B2System-on-chip devices and methods of designing a layout thereforSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 9, 2017·4 cites·19 claims
- 1280US12002738B2Stacked integrated circuit devicesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 4, 2024·0 cites·11 claims
- 1374US10134838B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 20, 2018·2 cites·20 claims
- 1474US2025031360A1Selective double diffusion break structures for multi-stack semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1573US2025056873A1Cross-coupled gate design for stacked device with separated top-down gateSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1670US11323119B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 3, 2022·0 cites·34 claims
- 1770US10579131B2Apparatus and method for applying suitable voltage to a component of a system-on-chipSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 3, 2020·2 cites·20 claims
- 1869US11101803B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 24, 2021·0 cites·29 claims
- 1961US12144163B2Selective double diffusion break structures for multi-stack semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 12, 2024·0 cites·19 claims
- 2060US10217647B2Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 26, 2019·0 cites·18 claims
- 2160US2024363532A1Integrated circuit including backside contact and method of designing the integrated circuitSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2259US12183738B2Cross-coupled gate design for stacked device with separated top-down gateSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 31, 2024·0 cites·14 claims
- 2358US2024250028A1Integrated circuit including backside wiring and method of designing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2456US2024128159A1Integrated circuit including standard cell with a metal layer having a pattern and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2555US12131996B2Stacked device with backside power distribution network and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 29, 2024·0 cites·7 claims
- 2655US2018174861A1Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 2755US2020152640A1Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 2854US2024169137A1Integrated circuit including standard cells and method of designing the sameSAMSUNGELECTRONICSCO LTD·Filed 2023·Application pending·0 cites
- 2952US12374623B2Stacked semiconductor device architectureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 29, 2025·0 cites·18 claims
- 3052US2022302131A1Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3152US2023352407A1Connection scheme with backside power distribution networkSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3251US2023343825A1Boundary gate structure for diffusion break in 3d-stacked semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3350US12019965B2Integrated circuit including standard cell and method of manufacturing the integrated circuitSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 25, 2024·0 cites·15 claims
- 3448US2023326858A1Reversed high aspect ratio contact (harc) structure and processSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3543US2021184038A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 3642US2013229398A1Display apparatus and method of driving the sameLEE DAE-YEON·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →