Inventor · disambiguated record
Seung-Kun Lee
Also filed as: LEE SEUNG-KUN
13 granted patents·6 pending applications·142 citations·filing 1998–2023
90Inventor score
Files withSAMSUNG ELECTRONICS CO LTD10HYUNDAI MOTOR CO LTD3AHN DUK-MIN1JUNG DONG-HOON1KIA MOTORS CORP1
Top patents by PatentIndex Score
19 records- 0171US6235147B1Wet-etching facility for manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted May 22, 2001·40 cites·19 claims
- 0270US6325527B1Vanity mirror of sun visor for automotive vehicleKIA MOTORS CORP·Filed 2000·Granted Dec 4, 2001·16 cites·3 claims
- 0364US7887636B2Substrate dryer and a drying methodSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 15, 2011·2 cites·15 claims
- 0460US6001216AApparatus and methods for rerecirculating etching solution during semiconductor wafer processingSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Dec 14, 1999·26 cites·23 claims
- 0559US6732750B2Semiconductor wafer cleaning apparatus and method of using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted May 11, 2004·8 cites·11 claims
- 0659US6146077AWafer transfer system of semiconductor fabricating equipment using a serial number detecting deviceSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Nov 14, 2000·25 cites·51 claims
- 0749US12466324B2Luggage board for car, luggage board manufacturing frame for car and method of manufacturing luggage board for carHYUNDAI MOTOR CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·9 claims
- 0849US12420724B2Luggage trim and luggage board of vehicleHYUNDAI MOTOR CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·17 claims
- 0949US6149379AWafer transfer method using a serial number detecting device in semiconductor fabricating equipmentSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Nov 21, 2000·15 cites·19 claims
- 1047US2024181970A1Vehicle covering shelf fixture apparatusHYUNDAI MOTOR CO LTD·Filed 2023·Application pending·0 cites
- 1145US7434589B2Wafer cleaning apparatus with anticipating malfunction of pumpSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 14, 2008·1 cites·8 claims
- 1242US7811921B2Semiconductor devices having a trench in a side portion of a conducting line pattern and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Oct 12, 2010·0 cites·16 claims
- 1340US6083320ARobot for and method of transporting semiconductor wafersSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Jul 4, 2000·9 cites·10 claims
- 1439US2006162748A1Wafer guide and semiconductor wafer drying apparatus using the sameLEE JONG-JAE·Filed 2006·Application pending·0 cites
- 1539US2006174913A1Apparatus for and method of wet processing semiconductor substratesJUNG DONG-HOON·Filed 2006·Application pending·0 cites
- 1637US7545046B2Semiconductor devices having a trench in a side portion of a conducting line pattern and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jun 9, 2009·0 cites·16 claims
- 1737US2006169300A1Method of and apparatus for heating liquid used in the manufacturing of semiconductor devices, and method of processing substrates with heated liquidAHN DUK-MIN·Filed 2006·Application pending·0 cites
- 1836US2005139240A1Rinsing and drying apparatus having rotatable nozzles and methods of rinsing and drying semiconductor wafers using the sameFiled 2004·Application pending·0 cites
- 1934US2007081886A1System and method for transferring and aligning wafersMYOUNG YOUNG-KWANG·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →