Inventor · disambiguated record
Seoung Jae Lee
Also filed as: LEE SEOUNG JAE
6 granted patents·3 pending applications·19 citations·filing 2006–2010
77Inventor score
Files withSAMSUNG ELECTRO MECH9
Top patents by PatentIndex Score
9 records- 0174US7619875B2Solid electrolytic capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Granted Nov 17, 2009·8 cites·21 claims
- 0269US8003173B2Method for forming a photoresist-laminated substrate, method for plating an insulating substrate, method for surface treating of a metal layer of a circuit board, and method for manufacturing a multi layer ceramic condenser using metal nanoparticles aerosolSAMSUNG ELECTRO MECH·Filed 2008·Granted Aug 23, 2011·5 cites·4 claims
- 0364US7633740B2Solid electrolytic capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Granted Dec 15, 2009·4 cites·23 claims
- 0458US7969710B2Solid electrolytic capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Granted Jun 28, 2011·2 cites·7 claims
- 0550US7993418B2Solid electrolytic capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2010·Granted Aug 9, 2011·0 cites·1 claims
- 0649US2009139875A1Electrolyte for electro-chemical machining of metal productSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0747US2009277679A1Method of manufacturing PCB and PCB manufactured by the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0844US2006243780A1Conductive substrate, motor, vibration motor and metal terminal for electrical contact having gold-copper layerSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 0943US7982138B2Method of nickel-gold plating and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Granted Jul 19, 2011·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →