Inventor · disambiguated record
Sea Hoon Lee
Also filed as: LEE SEA HOON
3 granted patents·10 pending applications·9 citations·filing 2010–2025
59Inventor score
Top patents by PatentIndex Score
13 records- 0187US10541064B2SiC powder, SiC sintered body, SiC slurry and manufacturing method of the sameKOREA INST MACH & MATERIALS·Filed 2016·Granted Jan 21, 2020·7 cites·6 claims
- 0263US2025089261A1Transistor and semiconductor memory device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0362US9096474B2Mold for synthesizing ceramic powder by means of a spark plasma sintering methodLEE SEA HOON·Filed 2010·Granted Aug 4, 2015·2 cites·7 claims
- 0462US2025294769A1Semiconductor devices having trench-based guard bands and electronic systems including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0559US2025318134A1Three-dimensional semiconductor memory device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0657US11524924B2SiC composite and method for manufacturing the sameKOREA INST MACH & MATERIALS·Filed 2020·Granted Dec 13, 2022·0 cites·10 claims
- 0756US2025048627A1Semiconductor device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0855US2024373632A1Three-dimensional semiconductor memory device, an electronic system including the same, and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0955US2024431113A1Semiconductor device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1055US2025017008A1Semiconductor device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1154US2025008726A1Semiconductor device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1252US2024130133A1Vertical nonvolatile memory device having hydrogen diffusion barrier layer and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1351US2025359062A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →