Inventor · disambiguated record
See Hiong Leow
Also filed as: LEOW SEE HIONG
11 granted patents·20 pending applications·94 citations·filing 2007–2025
87Inventor score
Technology areasH10W
Top patents by PatentIndex Score
31 records- 0195US8093702B2Stacked microelectronic devices and methods for manufacturing stacked microelectronic devicesLUA EDMUND KOON TIAN·Filed 2007·Granted Jan 10, 2012·74 cites·18 claims
- 0285US7741150B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2007·Granted Jun 22, 2010·12 cites·20 claims
- 0384US9147623B2Stacked microelectronic devices and methods for manufacturing stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2014·Granted Sep 29, 2015·5 cites·18 claims
- 0470US8501546B2Stacked microelectronic devices and methods for manufacturing stacked microelectronic devicesLUA EDMUND KOON TIAN·Filed 2012·Granted Aug 6, 2013·2 cites·16 claims
- 0568US12412811B2Split via structure for semiconductor device packagingMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 9, 2025·0 cites·18 claims
- 0664US8900923B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2013·Granted Dec 2, 2014·1 cites·8 claims
- 0761US2025203773A1Semiconductor package and methods of formationMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0860US2025183227A1High-density semiconductor chip packageMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0960US2024404995A1Apparatus including selectable circuit placement mechanism and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1059US2024304598A1Microelectronic devices, and related memory device packages and electronic systemsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1159US2024312890A1Semiconductor device assemblies with cross-stack structures, and associated methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1258US12463140B2Flexible interposer for semiconductor diesMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 4, 2025·0 cites·35 claims
- 1358US2024234390A1Stacked microelectronic package with stack mounted components and related methods, devices, and systemsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1458US2024234403A1Stacked microelectronic packages including interposer structures and related methods, devices, and systemsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1557US2024282751A1Substrates with downsetMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1657US2024332216A1Molded compound patterns on package ball side to mitigate coplanarity and warpageMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1756US12476216B2Wire bonding for stacked memory diesMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 18, 2025·0 cites·17 claims
- 1856US2024203842A1Semiconductor device assembly with a circular segmented package edgeMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1956US2024268132A1Legged support structure to mitigate stacked die overhang deflectionMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2055US9324676B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2014·Granted Apr 26, 2016·0 cites·12 claims
- 2155US2024194547A1Substrates for semiconductor packagesMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 2255US2024162206A1Load switch mounting for a semiconductor packageMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 2355US2024194630A1Bondable pillars for wire bonds in a semiconductor packageMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 2455US2024162207A1Passive electronic components on a semiconductor dieMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 2554US8803307B2Stacked microelectronic devices and methods for manufacturing stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2013·Granted Aug 12, 2014·0 cites·20 claims
- 2652US2024074048A1Semiconductor packaging with reduced standoff heightMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 2752US2024071990A1Extended bond pad for semiconductor device assembliesMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 2850US2024063201A1Non-conductive film for bonding a flip chip die to a substrateMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 2948US2023268327A1Semiconductor die assemblies with molded semiconductor dies and associated methods and systemsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 3045US2025266403A1Slanted die stacking to mitigate overhang deflectionMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3141US8399971B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesLEOW SEE HIONG·Filed 2010·Granted Mar 19, 2013·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →