Inventor · disambiguated record
Seol Hee Lim
Also filed as: LIM SEOL HEE
14 granted patents·13 pending applications·13 citations·filing 2012–2025
86Inventor score
Top patents by PatentIndex Score
27 records- 0188US10723852B2Heat shrinkable film composition comprising polyethyleneterephtalate resin and polyester based copolymer, and heat shrinkable filmSK CHEMICALS CO LTD·Filed 2018·Granted Jul 28, 2020·2 cites·1 claims
- 0287US11020947B2Thermo-shrinkable polyester filmSK CHEMICALS CO LTD·Filed 2015·Granted Jun 1, 2021·3 cites·6 claims
- 0385US10717811B2Polyester based copolymer resin and molded product comprising the sameSK CHEMICALS CO LTD·Filed 2014·Granted Jul 21, 2020·3 cites·4 claims
- 0484US10550223B2Polyester resin composition and preparation method thereofSK CHEMICALS CO LTD·Filed 2015·Granted Feb 4, 2020·2 cites·9 claims
- 0578US10696806B2Heat shrinkable film comprising polyester based copolymerSK CHEMICALS CO LTD·Filed 2014·Granted Jun 30, 2020·2 cites·4 claims
- 0674US11236210B2Heat shrinkable film composition comprising polyethyleneterephtalate resin and polyester based copolymer, and heat shrinkable filmSK CHEMICALS CO LTD·Filed 2020·Granted Feb 1, 2022·0 cites·1 claims
- 0773US11267934B2Polyester resin composition and preparation method thereofSK CHEMICALS CO LTD·Filed 2019·Granted Mar 8, 2022·0 cites·4 claims
- 0870US11203676B2Heat shrinkable film comprising polyester based copolymerSK CHEMICALS CO LTD·Filed 2020·Granted Dec 21, 2021·0 cites·3 claims
- 0969US2020299457A1Polyester based copolymer resin and molded product comprising the sameSK CHEMICALS CO LTD·Filed 2020·Application pending·0 cites
- 1067US2016122485A1Heat shrinkable film composition comprising polyethyleneterephtalate resin and polyester based copolymer, and heat shrinkable filmSK CHEMICALS CO LTD·Filed 2014·Application pending·0 cites
- 1166US2025044685A1Semiconductor photoresist composition and method of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 1262US2024345477A1Semiconductor photoresist composition and method of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 1359US2024241437A1Semiconductor photoresist composition and method of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2023·Application pending·0 cites
- 1458US2025264798A1Semiconductor photoresist compositions and methods of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 1557US2025271754A1Semiconductor photoresist compositions and methods of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 1656US2025054758A1Semiconductor photoresist composition and method of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 1756US2024345478A1Semiconductor photoresist composition and method of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 1854US11560457B2MDO thermoresistant heat-shrinkable filmSK CHEMICALS CO LTD·Filed 2017·Granted Jan 24, 2023·0 cites·11 claims
- 1952US9788438B2Printed circuit board for memory cardLG INNOTEK CO LTD·Filed 2012·Granted Oct 10, 2017·1 cites·5 claims
- 2050US2023384667A1Semiconductor photoresist composition and method of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2023·Application pending·0 cites
- 2149US11926117B2MDO thermoresistant heat-shrinkable multilayer filmSK CHEMICALS CO LTD·Filed 2017·Granted Mar 12, 2024·0 cites·5 claims
- 2247US11482593B2Composition for depositing thin film, manufacturing method for thin film using the composition, thin film manufactured from the composition, and semiconductor device including the thin filmSAMSUNG SDI CO LTD·Filed 2020·Granted Oct 25, 2022·0 cites·18 claims
- 2346US9661750B2Printed circuit board and method of manufacturing the sameLG INNOTEK CO LTD·Filed 2012·Granted May 23, 2017·0 cites·18 claims
- 2445US2025298309A1Semiconductor photoresist compositions and methods of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2025·Application pending·0 cites
- 2542US2017144420A1Multilayer polyester sheet and molded product made of the sameSK CHEMICALS CO LTD·Filed 2015·Application pending·0 cites
- 2641US9867288B2Semiconductor memory card, printed circuit board for memory card and method of fabricating the sameLG INNOTEK CO LTD·Filed 2013·Granted Jan 9, 2018·0 cites·3 claims
- 2738US2021193459A1Organic metal compound, composition for depositing thin film comprising the organic metal compound, manufacturing method for thin film using the composition, thin film manufactured from the composition, and semiconductor device including the thin filmSAMSUNG SDI CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →