Inventor · disambiguated record
Seiya Magota
Also filed as: MAGOTA SEIYA
0 granted patents·2 pending applications·0 citations·filing 2022–2023
Files withRESONAC CORP2
Top patents by PatentIndex Score
2 records- 0157US2024247120A1Prepreg, laminated plate, metal-clad laminated plate, printed wiring board, semiconductor package, method for manufacturing prepreg, and method for manufacturing metal-clad laminated plateRESONAC CORP·Filed 2022·Application pending·0 cites
- 0248US2025234458A1Metal-clad laminate, printed wiring board, semiconductor package, and method for manufacturing sameRESONAC CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →