Inventor · disambiguated record
Sebastian Michalski
Also filed as: MICHALSKI SEBASTIAN
3 granted patents·3 pending applications·0 citations·filing 2019–2025
45Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0159US11848213B2Semiconductor module having a layer that includes inorganic filler and a casting materialINFINEON TECHNOLOGIES AG·Filed 2021·Granted Dec 19, 2023·0 cites·5 claims
- 0250US12002740B2Printed circuit board, power semiconductor module arrangement comprising a printed circuit board, and method for assembling the sameINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jun 4, 2024·0 cites·15 claims
- 0350US2024266260A1Method for forming a terminal element, terminal element, and power semiconductor module arrangement having a terminal elementINFINEONTECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0449US11121004B2Semiconductor module and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2019·Granted Sep 14, 2021·0 cites·16 claims
- 0541US2025273633A1Semiconductor module arrangementINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0639US2025253220A1Power semiconductor module arrangementINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →