Inventor · disambiguated record
Seiichi Morimoto
Also filed as: MORIMOTO SEIICHI
16 granted patents·3 pending applications·679 citations·filing 1983–2018
95Inventor score
Files withINTEL CORP9TOKYO INST TECH4SANWA SHOJI CO LTD2MITSUBISHI HEAVY IND LTD1MITSUBISHI KASEI VINYL1
Top patents by PatentIndex Score
19 records- 0194US5081051AMethod for conditioning the surface of a polishing padINTEL CORP·Filed 1990·Granted Jan 14, 1992·206 cites·18 claims
- 0293US5198732ARotation control system for ultrasonic motorMITSUBISHI HEAVY IND LTD·Filed 1991·Granted Mar 30, 1993·86 cites·4 claims
- 0387US5104828AMethod of planarizing a dielectric formed over a semiconductor substrateINTEL CORP·Filed 1990·Granted Apr 14, 1992·75 cites·13 claims
- 0484US5127196AApparatus for planarizing a dielectric formed over a semiconductor substrateINTEL CORP·Filed 1991·Granted Jul 7, 1992·96 cites·8 claims
- 0581US8334184B2Polish to remove topography in sacrificial gate layer prior to gate patterningSTEIGERWALD JOSEPH M·Filed 2009·Granted Dec 18, 2012·10 cites·17 claims
- 0679US6081272AMerging dummy structure representations for improved distribution of artifacts in a semiconductor layerINTEL CORP·Filed 1997·Granted Jun 27, 2000·59 cites·26 claims
- 0779US5672095AElimination of pad conditioning in a chemical mechanical polishing processINTEL CORP·Filed 1995·Granted Sep 30, 1997·45 cites·26 claims
- 0877US4721548ASemiconductor planarization processINTEL CORP·Filed 1987·Granted Jan 26, 1988·46 cites·10 claims
- 0973US11466987B2Gyroscope and angle measurement methodTOKYO INST TECH·Filed 2018·Granted Oct 11, 2022·2 cites·5 claims
- 1059US7405419B2Unidirectionally conductive materials for interconnectionINTEL CORP·Filed 2005·Granted Jul 29, 2008·1 cites·13 claims
- 1159US5911111APolysilicon polish for patterning improvementINTEL CORP·Filed 1997·Granted Jun 8, 1999·18 cites·12 claims
- 1254US7084053B2Unidirectionally conductive materials for interconnectionINTEL CORP·Filed 2003·Granted Aug 1, 2006·5 cites·8 claims
- 1353US10968339B2Antioxidant-containing foamable resin particles, method for producing same, foamable particles, and foam-molded articleSEKISUI PLASTICS·Filed 2016·Granted Apr 6, 2021·0 cites·9 claims
- 1452US4600477AMethod of processing fermented liquidSANWA SHOJI CO LTD·Filed 1985·Granted Jul 15, 1986·16 cites·3 claims
- 1545US4554255ADetermination of sulfurous acid in liquids and an apparatus thereforSANWA SHOJI CO LTD·Filed 1983·Granted Nov 19, 1985·13 cites·4 claims
- 1644US2020256677A1Atomic interferometric gyroscopeTOKYO INST TECH·Filed 2018·Application pending·0 cites
- 1744US2020333139A1Mach-zehnder type atomic interferometric gyroscopeTOKYO INST TECH·Filed 2018·Application pending·0 cites
- 1841US2020318968A1Mach-zehnder type atomic interferometric gyroscopeTOKYO INST TECH·Filed 2018·Application pending·0 cites
- 1919US4948670AVinyl chloride resin composition for coating electric wiresMITSUBISHI KASEI VINYL·Filed 1989·Granted Aug 14, 1990·1 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →