Inventor · disambiguated record
Seyyed Yahya Mousavi
Also filed as: MOUSAVI SEYYED YAHYA
0 granted patents·3 pending applications·0 citations·filing 2023–2023
Technology areasH10W
Files withINTEL CORP3
Top patents by PatentIndex Score
3 records- 0156US2025112085A1Apparatus and methods for capillary underfill of embedded devicesINTEL CORP·Filed 2023·Application pending·0 cites
- 0253US2025112161A1Methods and apparatus to connect interconnect bridges to package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 0352US2025218953A1Methods and apparatus for embedding interconnect bridges having through silicon vias in substratesINTEL CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →