Inventor · disambiguated record
Seon Jae Mun
Also filed as: MUN SEON JAE
12 granted patents·11 pending applications·6 citations·filing 2007–2024
82Inventor score
Top patents by PatentIndex Score
23 records- 0175US2024379289A1Multilayer electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 0274US2024274368A1Multilayered electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 0370US12051543B2Mutilayer electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2022·Granted Jul 30, 2024·0 cites·33 claims
- 0470US12002628B2Multilayered electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2022·Granted Jun 4, 2024·0 cites·27 claims
- 0561US8671564B2Substrate for flip chip bonding and method of fabricating the sameOH HUENG JAE·Filed 2009·Granted Mar 18, 2014·3 cites·8 claims
- 0661US8456003B2Package substrate capable of controlling the degree of warpageLEE DONG GYU·Filed 2010·Granted Jun 4, 2013·1 cites·6 claims
- 0760US10770227B2Capacitor and board having the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Sep 8, 2020·0 cites·19 claims
- 0860US8486760B2Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the sameCHUNG TAE JOON·Filed 2010·Granted Jul 16, 2013·2 cites·11 claims
- 0953US11049659B2Multilayer ceramic electronic component and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Jun 29, 2021·0 cites·8 claims
- 1052US8835302B2Method of fabricating a package substrateSAMSUNG ELECTRO MECH·Filed 2013·Granted Sep 16, 2014·0 cites·8 claims
- 1151US12002627B2Multilayer electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2022·Granted Jun 4, 2024·0 cites·16 claims
- 1251US11996244B2Multilayer electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2022·Granted May 28, 2024·0 cites·23 claims
- 1350US12002623B2Multilayered electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Jun 4, 2024·0 cites·20 claims
- 1450US11990284B2Multilayered electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted May 21, 2024·0 cites·24 claims
- 1549US2014138821A1Substrate for flip chip bonding and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1647US2009025581A1Mask for screen printing and screen printing method using the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1746US2010271792A1Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1845US2010044084A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1945US2010132998A1Substrate having metal post and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2041US2013168144A1Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2139US2014103098A1Mask for bumping solder balls on circuit board and solder ball bumping method using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2237US2011133332A1Package substrate and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 2335US2012047671A1Squeegee modulePARK YEO IL·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →