Inventor · disambiguated record
Seiya Nakai
Also filed as: NAKAI SEIYA
12 granted patents·1 pending application·327 citations·filing 1996–2016
92Inventor score
Top patents by PatentIndex Score
13 records- 0192US6247628B1Ultrasonic vibration bonding toolULTEX CORP·Filed 2000·Granted Jun 19, 2001·57 cites·10 claims
- 0288US6491785B1Ultrasonic vibration bonding machineULTEX CORP·Filed 2000·Granted Dec 10, 2002·60 cites·3 claims
- 0383US5730832AUltrasonic vibration bonding machineULTEX CORP·Filed 1996·Granted Mar 24, 1998·55 cites·4 claims
- 0475US6168063B1Ultrasonic vibration bonding machineULTEX CORP·Filed 1999·Granted Jan 2, 2001·48 cites·3 claims
- 0575US5931367ARemovable bonding working portions for an ultrasonic welderULTEX CORP·Filed 1997·Granted Aug 3, 1999·35 cites·12 claims
- 0671US5884831AUltrasonic vibration bonding chip mounterULTEX CORP·Filed 1997·Granted Mar 23, 1999·44 cites·4 claims
- 0770US8353442B2Support device for resonatorADWELDS CORP·Filed 2009·Granted Jan 15, 2013·5 cites·24 claims
- 0865US10029408B2Welding apparatus and welding methodADWELDS CORP·Filed 2014·Granted Jul 24, 2018·1 cites·2 claims
- 0959US8910375B2Mounting apparatusNAKAI SEIYA·Filed 2009·Granted Dec 16, 2014·3 cites·5 claims
- 1055US6818098B2Ultrasonic bonding machineULTEX CORP·Filed 2003·Granted Nov 16, 2004·5 cites·9 claims
- 1150US5883460ASupport unit for ultrasonic vibration resonatorULTEX CORP·Filed 1997·Granted Mar 16, 1999·14 cites·9 claims
- 1249US10434730B2Treatment device and treatment methodADWELDS CORP·Filed 2016·Granted Oct 8, 2019·0 cites·12 claims
- 1342US2013152757A1Vibration cutting apparatusNAKAI SEIYA·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →