Inventor · disambiguated record
Seiya Nakano
Also filed as: NAKANO SEIYA
6 granted patents·7 pending applications·1 citations·filing 2003–2025
65Inventor score
Top patents by PatentIndex Score
13 records- 0159US12115480B2Particle adhesion device, method for producing filter, and pillar shaped honeycomb filterNGK INSULATORS LTD·Filed 2022·Granted Oct 15, 2024·0 cites·12 claims
- 0258US10157865B2Semiconductor device with metal film and method for manufacturing semiconductor device with metal filmMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Dec 18, 2018·1 cites·15 claims
- 0355US11612844B2Pillar-shaped honeycomb structure filterNGK INSULATORS LTD·Filed 2022·Granted Mar 28, 2023·0 cites·7 claims
- 0455US2025140719A1Semiconductor apparatusMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0554US2022314250A1Method for manufacturing pillar-shaped honeycomb structure filter, and particle attaching device for pillar-shaped honeycomb structureNGK INSULATORS LTD·Filed 2022·Application pending·0 cites
- 0648US2025380438A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0744US10461049B2Semiconductor device and manufacturing method thereforMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Oct 29, 2019·0 cites·13 claims
- 0842US2024006475A1Semiconductor device and semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 0940US2021268905A1Vehicle driving assistance system, vehicle driving assistance method, and vehicle driving assistance programAISIN AW CO·Filed 2019·Application pending·0 cites
- 1039US2004120059A1Electrically retractable outer mirrorMURAKAMI CORP·Filed 2003·Application pending·0 cites
- 1139US2022376073A1Schottky barrier diodeMITSUBISHI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 1238US10804169B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Oct 13, 2020·0 cites·18 claims
- 1335US8791568B2Semiconductor deviceNAKANO SEIYA·Filed 2012·Granted Jul 29, 2014·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →