Inventor · disambiguated record
Seo-Woo Nam
Also filed as: NAM SEO-WOO
15 granted patents·11 pending applications·22 citations·filing 2005–2025
88Inventor score
Top patents by PatentIndex Score
26 records- 0192US11837548B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 5, 2023·2 cites·20 claims
- 0283US12327759B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 10, 2025·1 cites·16 claims
- 0378US7642148B2Methods of producing semiconductor devices including multiple stress films in interface areaSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jan 5, 2010·7 cites·11 claims
- 0470US10163782B2Fuse structure having multiple air dummy fusesSK HYNIX INC·Filed 2017·Granted Dec 25, 2018·1 cites·12 claims
- 0569US7785951B2Methods of forming integrated circuit devices having tensile and compressive stress layers therein and devices formed therebySAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 31, 2010·3 cites·17 claims
- 0668US9735104B1Fuse structure having multiple air dummy fusesSK HYNIX INC·Filed 2016·Granted Aug 15, 2017·1 cites·16 claims
- 0768US2025273512A1Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0867US7759185B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 20, 2010·4 cites·15 claims
- 0965US7972958B2Method of fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jul 5, 2011·3 cites·18 claims
- 1063US2025241012A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1159US2025056838A1Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1258US10727181B2Fuse structure having air dummy fuses and semiconductor device including the sameSK HYNIX INC·Filed 2018·Granted Jul 28, 2020·0 cites·7 claims
- 1358US2024421090A1Semiconductor device and method for fabricating thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1454US10700060B2E-fuse for use in semiconductor deviceSK HYNIX INC·Filed 2019·Granted Jun 30, 2020·0 cites·3 claims
- 1552US7902609B2Semiconductor devices including multiple stress films in interface areaSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Mar 8, 2011·0 cites·11 claims
- 1649US2007178644A1Semiconductor device having an insulating layer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1746US10607934B2Fuse of semiconductor device and method for forming the sameSK HYNIX INC·Filed 2017·Granted Mar 31, 2020·0 cites·3 claims
- 1846US2019088646A1E-fuse for use in semiconductor deviceSK HYNIX INC·Filed 2018·Application pending·0 cites
- 1946US2023178477A1Semiconductor device and method for fabricating the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2045US10497700B2Anti-fuse for use in semiconductor deviceSK HYNIX INC·Filed 2018·Granted Dec 3, 2019·0 cites·18 claims
- 2143US10685913B2E-fuse for use in semiconductor deviceSK HYNIX INC·Filed 2018·Granted Jun 16, 2020·0 cites·7 claims
- 2240US7307014B2Method of forming a via contact structure using a dual damascene processSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 11, 2007·0 cites·26 claims
- 2335US2010173497A1Method of fabricating semiconductor integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
- 2435US2019088596A1E-fuse for use in semiconductor deviceSK HYNIX INC·Filed 2018·Application pending·0 cites
- 2532US2008081406A1Method of Fabricating Semiconductor Device Having Dual Stress LinerCHOO JAE-OUK·Filed 2007·Application pending·0 cites
- 2625US2011201202A1Method of forming fine patterns of semiconductor deviceCHANG CHONG-KWANG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →