Inventor · disambiguated record
Seung Hyun Noh
Also filed as: NOH SEUNG HYUN
4 granted patents·7 pending applications·5 citations·filing 2011–2024
60Inventor score
Files withSAMSUNG ELECTRO MECH5OKINS ELECTRONICS CO LTD3LEE DONG UK1NOH SEUNG HYUN1REGENTS OFTHE UNIVERSITY OF CALIFORNIA1
Top patents by PatentIndex Score
11 records- 0178US9137886B2Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Sep 15, 2015·5 cites·20 claims
- 0265US12222367B2Contact pins for test sockets and test sockets comprising the sameOKINS ELECTRONICS CO LTD·Filed 2023·Granted Feb 11, 2025·0 cites·13 claims
- 0362US12245370B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2022·Granted Mar 4, 2025·0 cites·20 claims
- 0454US2024361352A1Test socket and assembly device thereofOKINS ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0554US2024364050A1Test connectorOKINS ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0652US2024222020A1Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 0749US9392699B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Jul 12, 2016·0 cites·1 claims
- 0847US2014290982A1Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 0943US2016000918A1Supramolecular magnetic nanoparticlesREGENTS OFTHE UNIVERSITY OF CALIFORNIA·Filed 2014·Application pending·0 cites
- 1040US2011297423A1Printed circuit board and method of manufacturing the sameNOH SEUNG HYUN·Filed 2011·Application pending·0 cites
- 1134US2012087098A1Package substrateLEE DONG UK·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →