Inventor · disambiguated record
Seungha Oh
Also filed as: OH SEUNGHA
10 granted patents·2 pending applications·16 citations·filing 2020–2023
82Inventor score
Top patents by PatentIndex Score
12 records- 0196US11121080B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 14, 2021·4 cites·20 claims
- 0295US11177286B2Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 16, 2021·9 cites·20 claims
- 0394US11728347B2Method of manufacturing an integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·3 cites·8 claims
- 0474US12167596B2Three-dimensional semiconductor devices and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 0567US11610838B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 21, 2023·0 cites·20 claims
- 0663US11990473B2Integrated circuits and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 21, 2024·0 cites·17 claims
- 0762US11552096B2Three-dimensional semiconductor devices and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 10, 2023·0 cites·20 claims
- 0856US11335680B2Integrated circuits and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 17, 2022·0 cites·18 claims
- 0955US2024047305A1Integrated circuit semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1055US2025198555A1Latch systems and methods for fluid line couplingGM GLOBAL TECH OPERATIONS LLC·Filed 2023·Application pending·0 cites
- 1152US12341084B2Integrated circuit device with through-electrode and electrode landing pad, and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 24, 2025·0 cites·17 claims
- 1246US11901356B2Three-dimensional semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 13, 2024·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →