Inventor · disambiguated record
Seiya Okamura
Also filed as: Okamura Seiya
0 granted patents·4 pending applications·0 citations·filing 2022–2025
Files withHONDA MOTOR CO LTD4
Top patents by PatentIndex Score
4 records- 0161US2025303672A1Joined body and joining methodHONDA MOTOR CO LTD·Filed 2025·Application pending·0 cites
- 0261US2023256542A1Method of manufacturing joined memberHONDA MOTOR CO LTD·Filed 2022·Application pending·0 cites
- 0358US2023234166A1Joined member and method of manufacturing joined memberHONDA MOTOR CO LTD·Filed 2022·Application pending·0 cites
- 0450US2023202573A1Bonding structureHONDA MOTOR CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →