Inventor · disambiguated record
See Yap Ong
Also filed as: ONG SEE YAP
10 granted patents·11 citations·filing 2001–2013
80Inventor score
Top patents by PatentIndex Score
10 records- 0164US8011917B2Compression molding of an electronic deviceASM TECH SINGAPORE PTE LTD·Filed 2007·Granted Sep 6, 2011·2 cites·15 claims
- 0264US7927087B2Method and apparatus for molding with reduced cull formationASM TECH SINGAPORE PTE LTD·Filed 2005·Granted Apr 19, 2011·1 cites·13 claims
- 0360US9254641B2Screen printer, and method of cleaning a stencil of a screen printerASM TECH SINGAPORE PTE LTD·Filed 2013·Granted Feb 9, 2016·0 cites·12 claims
- 0453US6752896B2Method of detaching a film of material from a substrateASM TECH SINGAPORE PTE LTD·Filed 2001·Granted Jun 22, 2004·6 cites·7 claims
- 0544US6656320B2Removal of masking tape from lead framesASM TECH SINGAPORE PTE LTD·Filed 2001·Granted Dec 2, 2003·2 cites·19 claims
- 0642US9346205B2Optical device molding systemHO SHU CHUEN·Filed 2009·Granted May 24, 2016·0 cites·17 claims
- 0742US7695269B2Apparatus and method for in-mold degatingASM TECH SINGAPORE PTE LTD·Filed 2007·Granted Apr 13, 2010·0 cites·18 claims
- 0840US6808661B2Method for encapsulating leadframe-mounted integrated circuitsASM TECH SINGAPORE PTE LTD·Filed 2001·Granted Oct 26, 2004·0 cites·8 claims
- 0936US7030504B2Sectional molding systemASM TECH SINGAPORE PTE LTD·Filed 2003·Granted Apr 18, 2006·0 cites·15 claims
- 1035US9199396B2Substrate carrier for molding electronic devicesKUAH TENG HOCK·Filed 2010·Granted Dec 1, 2015·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →