Inventor · disambiguated record
Seiji Osada
Also filed as: OSADA SEIJI
4 granted patents·1 pending application·0 citations·filing 2022–2025
53Inventor score
Technology areasH01F
Files withTDK CORP5
Top patents by PatentIndex Score
5 records- 0178US2025253090A1Method for manufacturing multi-layer coil componentTDK CORP·Filed 2025·Application pending·0 cites
- 0275US12334247B2Multi-layer coil componentTDK CORP·Filed 2022·Granted Jun 17, 2025·0 cites·6 claims
- 0366US12347596B2Multi-layer inductorTDK CORP·Filed 2022·Granted Jul 1, 2025·0 cites·7 claims
- 0461US12347597B2Multi-layer inductorTDK CORP·Filed 2022·Granted Jul 1, 2025·0 cites·4 claims
- 0557US12400785B2Multi-layer coil componentTDK CORP·Filed 2022·Granted Aug 26, 2025·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →