Inventor · disambiguated record
Seppo Pienimaa
Also filed as: PIENIMAA SEPPO
10 granted patents·2 pending applications·181 citations·filing 1985–2017
90Inventor score
Top patents by PatentIndex Score
12 records- 0193US7997723B2Display apparatus and deviceNOKIA CORP·Filed 2008·Granted Aug 16, 2011·42 cites·22 claims
- 0279US6110563AMethod and arrangement for electromagnetically shielding an electronic meansNOKIA MOBILE PHONES LTD·Filed 1996·Granted Aug 29, 2000·53 cites·21 claims
- 0370US8581851B2Method and device for character input having a base character component and a supplemental character componentPIENIMAA SEPPO·Filed 2007·Granted Nov 12, 2013·6 cites·20 claims
- 0470US6773114B2Portable multimode display deviceNOKIA CORP·Filed 2001·Granted Aug 10, 2004·13 cites·20 claims
- 0559US2015121774A1Arrangement for attaching panels to support structures, a construction support structure and fastening means, and their use in modular building elementsDaSeiNa Oy·Filed 2014·Application pending·0 cites
- 0658US8629855B2Multimode apparatus and method for making samePIENIMAA SEPPO·Filed 2007·Granted Jan 14, 2014·2 cites·20 claims
- 0758US5665525AMethod for producing printed circuit boardsNOKIA MOBILE PHONES LTD·Filed 1995·Granted Sep 9, 1997·23 cites·8 claims
- 0857USD843132SDe-icing mat with a patternPISTESARJAT OY·Filed 2017·Granted Mar 19, 2019·9 cites·1 claims
- 0956US8120762B2Light guide and optical sensing module input device and method for making sameLEVOLA TAPANI·Filed 2008·Granted Feb 21, 2012·2 cites·21 claims
- 1054US6073829AMethod and arrangement for attaching a componentNOKIA MOBILE PHONES LTD·Filed 1998·Granted Jun 13, 2000·19 cites·12 claims
- 1142US4711688AMethod for encapsulating semiconductor components mounted on a carrier tapeLOHJA AB OY·Filed 1985·Granted Dec 8, 1987·12 cites·6 claims
- 1242US2006178110A1System and method for interacting with an entity by means of a mobile station via a user-wearable terminalNOKIA CORP·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →