Inventor · disambiguated record
Sébastien S. Quesnel
Also filed as: QUESNEL SEBASTIEN · QUESNEL SEBASTIEN S · QUESNEL SÉBASTIEN S
3 granted patents·12 citations·filing 2014–2014
61Inventor score
Files withIBM3
Top patents by PatentIndex Score
3 records- 0182US9875985B2Flip-chip bonder with induction coils and a heating elementIBM·Filed 2014·Granted Jan 23, 2018·6 cites·16 claims
- 0281US9190375B2Solder bump reflow by induction heatingIBM·Filed 2014·Granted Nov 17, 2015·6 cites·20 claims
- 0344US9177931B2Reducing thermal energy transfer during chip-join processingIBM·Filed 2014·Granted Nov 3, 2015·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →