Inventor · disambiguated record
Seung Hyun Ra
Also filed as: RA SEUNG H · RA SEUNG HYUN
12 granted patents·26 pending applications·64 citations·filing 2002–2019
88Inventor score
Top patents by PatentIndex Score
38 records- 0181US9997294B2Electronic component and circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jun 12, 2018·2 cites·14 claims
- 0278US7438622B2Fabrication method of carbon-fiber web structure type field emitter electrodeSAMSUNG ELECTRO MECH·Filed 2005·Granted Oct 21, 2008·4 cites·5 claims
- 0378US6876840B2Triplexer and multilayered structure thereofSAMSUNG ELECTRO MECH·Filed 2002·Granted Apr 5, 2005·23 cites·14 claims
- 0476US8058787B2Carbon-fiber web structure type field emitter electrode and fabrication method of the sameRA SEUNG HYUN·Filed 2008·Granted Nov 15, 2011·7 cites·17 claims
- 0574US7203055B2Method of manufacturing multilayered ceramic capacitor by spin coating and multilayered ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2004·Granted Apr 10, 2007·22 cites·49 claims
- 0664US7644496B2Manufacturing method for imprinting stamperSAMSUNG ELECTRO MECH·Filed 2007·Granted Jan 12, 2010·2 cites·6 claims
- 0761US8226808B2Method for manufacturing metal electrode having transition metallic coating layer and metal electrode manufactured therebyKIM HAK-KWAN·Filed 2009·Granted Jul 24, 2012·2 cites·5 claims
- 0859US10714265B2Laminated electronic component and circuit board for mounting the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Jul 14, 2020·0 cites·19 claims
- 0959US7562447B2Method of manufacturing printed circuit board for fine circuit formationSAMSUNG ELECTRO MECH·Filed 2007·Granted Jul 21, 2009·2 cites·7 claims
- 1051US2017011854A1Laminated electronic component and circuit board for mounting the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 1150US2008090084A1Flame retardant resin composition for printed circuit board and printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1245US2008034581A1Method for manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1345US2010220430A1Supercapacitor electrode using ion-exchangerSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1444US2010195269A1Hybrid supercapacitor using surface-oxidized transition metal nitride aerogelSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1544US2011058307A1Chip-type electric double layer capacitor and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1644US2008054518A1Method of manufacturing a stamperSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1744US2008057444A1Method of manufacturing a broad stamperSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1844US2011058306A1Chip-type electric double layer capacitor and package structure thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1943US9887040B2Multilayer electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Feb 6, 2018·0 cites·15 claims
- 2043US7666292B2Method of manufacturing printed circuit board using imprinting processSAMSUNG ELECTRO MECH·Filed 2006·Granted Feb 23, 2010·0 cites·2 claims
- 2143US2012262844A1Method for manufacturing metal electrode having transition metallic coating layer and metal electrode manufactured therebyKIM HAK-KWAN·Filed 2012·Application pending·0 cites
- 2243US2014049484A1Touch panel and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2342US2007020397A1Method of fabricating printed circuit board using imprinting processSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 2442US2014062908A1Touch panel and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2541US2006222833A1Imprinting mold for printed circuit board having excellent durability and method of manufacturing printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 2640US2006052026A1Method of producing field emission type cold-cathode deviceSAMSUNG ELECTRO MECH·Filed 2004·Application pending·0 cites
- 2740US2006226566A1Imprinting apparatus, system and methodSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 2840US2012043945A1Apparatus for equalizing voltage using time switchKIM YONG WOOK·Filed 2011·Application pending·0 cites
- 2938US7338854B2Method for manufacturing multilayer ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2004·Granted Mar 4, 2008·0 cites·40 claims
- 3038US2013277100A1Touch panel and method of manufacturing the sameRA SEUNG HYUN·Filed 2012·Application pending·0 cites
- 3138US2013328575A1Touch sensor and method of manufacturing the sameRA SEUNG HYUN·Filed 2012·Application pending·0 cites
- 3238US2012050946A1Supercapacitor moduleRA SEUNG HYUN·Filed 2011·Application pending·0 cites
- 3337US2012063059A1Hybrid supercapacitor and method of manufacturing the sameRA SEUNG HYUN·Filed 2011·Application pending·0 cites
- 3436US2013047420A1Method for manufacturing touch panelRA SEUNG HYUN·Filed 2011·Application pending·0 cites
- 3536US2012300285A1Electronic paper display device and method of manufacturing the sameRA SEUNG HYUN·Filed 2012·Application pending·0 cites
- 3635US2013047428A1Method of manufacturing touch panelRA SEUNG HYUN·Filed 2011·Application pending·0 cites
- 3734US2012319562A1Led package and manufacturing method thereofRA SEUNG HYUN·Filed 2012·Application pending·0 cites
- 3834US2013307565A1Touch sensor and method of manufacturing the sameRA SEUNG HYUN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →