Inventor · disambiguated record
Seunggeol Ryu
Also filed as: RYU SEUNGGEOL
6 granted patents·7 pending applications·5 citations·filing 2021–2025
71Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD13
Top patents by PatentIndex Score
13 records- 0191US12009303B2Integrated circuit semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 11, 2024·5 cites·20 claims
- 0276US12237268B2Integrated circuit semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Feb 25, 2025·0 cites·20 claims
- 0369US12243803B2Thermal interface material, method of manufacturing the same, and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Mar 4, 2025·0 cites·20 claims
- 0468US12506047B2Semiconductor package and cooling systemSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 23, 2025·0 cites·19 claims
- 0566US2025157930A1Integrated circuit semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0658US11935812B2Thermal interface material and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 19, 2024·0 cites·20 claims
- 0755US2025183214A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0853US2025167155A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0951US2024030185A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1050US12431403B2Semiconductor package including thermal interface material (TIM) layers on semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·16 claims
- 1150US2023178450A1Film packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1235US2025266384A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1335US2025379155A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →