Inventor · disambiguated record
Seungkwan Ryu
Also filed as: RYU SEUNGKWAN
8 granted patents·3 pending applications·10 citations·filing 2020–2025
78Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD11
Top patents by PatentIndex Score
11 records- 0195US11587859B2Wiring protection layer on an interposer with a through electrodeSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 21, 2023·5 cites·20 claims
- 0295US11195785B2Interposer with through electrode having a wiring protection layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 7, 2021·5 cites·20 claims
- 0378US2025132238A1Interposer, semiconductor package including the same, and method of fabricating the interposerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0475US12272630B2Interposer and semiconductor package including sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·16 claims
- 0572US12218043B2Interposer, semiconductor package including the same, and method of fabricating the interposerSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 0672US2025192015A1Interposer and semiconductor package including sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0767US11482483B2Interposer, semiconductor package including the same, and method of fabricating the interposerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 25, 2022·0 cites·20 claims
- 0866US11728255B2Interposer and semiconductor package including sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·11 claims
- 0965US12021032B2Semiconductor package having an interposer and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 25, 2024·0 cites·20 claims
- 1057US11694961B2Semiconductor package having an interposer and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 4, 2023·0 cites·11 claims
- 1157US2024112998A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →