Inventor · disambiguated record
Seung-Kwan Ryu
Also filed as: RYU SEUNG-KWAN
21 granted patents·8 pending applications·97 citations·filing 2005–2025
94Inventor score
Top patents by PatentIndex Score
29 records- 0196US11676902B2Semiconductor package including interposerSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 13, 2023·2 cites·20 claims
- 0296US9666551B1Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 30, 2017·17 cites·20 claims
- 0394US2025385189A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0493US10008462B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jun 26, 2018·12 cites·9 claims
- 0593US9831202B2Semiconductor devices with solder-based connection terminals and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 28, 2017·11 cites·14 claims
- 0691US11081440B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 3, 2021·7 cites·19 claims
- 0790US11244904B2Semiconductor package including interposerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 8, 2022·4 cites·20 claims
- 0889US11348876B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 31, 2022·2 cites·20 claims
- 0987US12424561B2Semiconductor package including interposerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Sep 23, 2025·0 cites·18 claims
- 1085US10134702B2Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 20, 2018·4 cites·17 claims
- 1185US7205660B2Wafer level chip scale package having a gap and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 17, 2007·12 cites·10 claims
- 1284US10186500B2Semiconductor package and method of fabricating the sameRYU SEUNG KWAN·Filed 2016·Granted Jan 22, 2019·6 cites·16 claims
- 1382US11996366B2Semiconductor package including interposerSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 28, 2024·0 cites·20 claims
- 1477US7544538B2Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 9, 2009·6 cites·15 claims
- 1576US9972580B2Semiconductor package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 15, 2018·2 cites·14 claims
- 1676US7312143B2Wafer level chip scale package having a gap and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 25, 2007·6 cites·10 claims
- 1775US10879187B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 29, 2020·2 cites·18 claims
- 1866US2007184577A1Method of fabricating wafer level packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1964US11705391B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 18, 2023·0 cites·20 claims
- 2064US8039937B2Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Oct 18, 2011·2 cites·8 claims
- 2161US7825495B2Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Nov 2, 2010·2 cites·19 claims
- 2261US2009020878A1Semiconductor packages and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2354US10734367B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 4, 2020·0 cites·19 claims
- 2449US11217503B2Semiconductor package having logic semiconductor chip and memory packages on interposerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 4, 2022·0 cites·19 claims
- 2546US2008173999A1Stack package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2643US2007164431A1Wafer level chip scale package having rerouting layer and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2742US2020312674A1Method of manufacturing an interposer and a method of manufacturing a semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 2842US2007069320A1Wiring structure of a semiconductor package and method of manufacturing the same, and wafer level package having the wiring structure and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2928US2016148888A1Semiconductor devices and methods for fabricating the sameRYU SEUNG-KWAN·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →