Inventor · disambiguated record
Seung Dae Seok
Also filed as: SEOK SEUNG DAE
6 granted patents·4 pending applications·19 citations·filing 2009–2022
77Inventor score
Top patents by PatentIndex Score
10 records- 0191US11600515B2Die pickup module and die bonding apparatus including the sameSEMES CO LTD·Filed 2020·Granted Mar 7, 2023·6 cites·18 claims
- 0273US9620476B2Bonding head and die bonding apparatus having the sameSEMES CO LTD·Filed 2014·Granted Apr 11, 2017·6 cites·15 claims
- 0373US9431365B2Apparatus for bonding semiconductor chipsSEOK SEUNG-DAE·Filed 2015·Granted Aug 30, 2016·4 cites·20 claims
- 0470US10058952B2Bonding stage and bonding apparatus comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 28, 2018·2 cites·16 claims
- 0556US9508577B2Semiconductor manufacturing apparatuses comprising bonding headsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 29, 2016·1 cites·3 claims
- 0654US2023115922A1Method for monitoring substrate, method for fabricating semiconductor device using the same, and substrate process system using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0749US12090642B2Die pickup module and die bonding apparatus including the sameSEMES CO LTD·Filed 2020·Granted Sep 17, 2024·0 cites·15 claims
- 0847US2010071847A1Wafer bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 0939US2013248114A1Chip bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1039US2013139380A1Chip bonding apparatus and chip bonding method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →