Inventor · disambiguated record
Seung Kwon Seol
Also filed as: SEOL SEUNG KWON
4 granted patents·5 pending applications·5 citations·filing 2007–2022
63Inventor score
Files withKERI KOREA ELECTROTECHNOLOGY RES INST5SEOL SEUNG KWON2JE JUNG HO1KOREA ELECTROTECH RES INST1
Top patents by PatentIndex Score
9 records- 0186US11597225B2Silver ink for 3D printing and 3D printing method using sameKERI KOREA ELECTROTECHNOLOGY RES INST·Filed 2018·Granted Mar 7, 2023·2 cites·12 claims
- 0278US11512210B2Method for 3D printing of carbon nanotube microstructure having high conductivity, and ink used thereinKERI KOREA ELECTROTECHNOLOGY RES INST·Filed 2016·Granted Nov 29, 2022·2 cites·14 claims
- 0373US2023053799A1Method for 3d printing of carbon nanotube microstructure having high conductivity, and ink used thereinKERI KOREA ELECTROTECHNOLOGY RES INST·Filed 2022·Application pending·0 cites
- 0462US2021340397A1Catalyst ink for plating and electroless plating method using sameKERI KOREA ELECTROTECHNOLOGY RES INST·Filed 2018·Application pending·0 cites
- 0554US2009308754A1Fabrication of freestanding micro hollow tubes by template-free localized electrochemical depositionSEOL SEUNG KWON·Filed 2009·Application pending·0 cites
- 0652US8345818B2Tomosynthesis system for digital X-ray imaging and method of controlling the sameKOREA ELECTROTECH RES INST·Filed 2010·Granted Jan 1, 2013·1 cites·14 claims
- 0746US10660166B2Microwave heating apparatus for uniformly heating objects based on near-cutoff conditionKERI KOREA ELECTROTECHNOLOGY RES INST·Filed 2013·Granted May 19, 2020·0 cites·18 claims
- 0846US2008173546A1Fabrication of freestanding micro hollow tubes by template-free localized electrochemical depositionSEOL SEUNG KWON·Filed 2007·Application pending·0 cites
- 0928US2012298401A1Method for fabricating a three-dimensional ultrafine polymer conducting wire, omnidirectional wiring, and ultrafine polymer conducting wire fabricated using the methodJE JUNG HO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →