Inventor · disambiguated record
Seungmin Shin
Also filed as: SHIN SEUNGMIN
5 granted patents·6 pending applications·0 citations·filing 2021–2025
62Inventor score
Top patents by PatentIndex Score
11 records- 0180US12278133B2Substrate transferring unit, substrate processing apparatus, and substrate processing methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·4 claims
- 0273US2025210405A1Substrate transferring unit, substrate processing apparatus, and substrate processing methodSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0371US11881426B2Substrate transferring unit, substrate processing apparatus, and substrate processing methodSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 23, 2024·0 cites·10 claims
- 0465US11798801B2Apparatus including light source supplying light to wafer and window protector receiving a portion of chemical liquidSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 24, 2023·0 cites·17 claims
- 0563US11482410B2Apparatus including light source supplying light to wafer and window protector receiving a portion of chemical liquidSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 25, 2022·0 cites·20 claims
- 0658US2024373621A1Method for manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0753US12223426B2Method and apparatus for designing and testing audio codec by using white noise modelingELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Granted Feb 11, 2025·0 cites·12 claims
- 0853US2024251544A1Semiconductor memory device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0953US2024167156A1Fluidic baffle for high pressure fluid distribution and substrate processing apparatusSEMES CO LTD·Filed 2023·Application pending·0 cites
- 1052US2025079154A1Method of manufacturing integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1146US2024030038A1Atomic layer etching (ale) apparatus and ale method based on the apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →