Inventor · disambiguated record
Seunghun Shin
Also filed as: SHIN SEUNGHUN
10 granted patents·5 pending applications·18 citations·filing 2016–2024
84Inventor score
Top patents by PatentIndex Score
15 records- 0196US11424172B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 23, 2022·6 cites·12 claims
- 0295US11869821B2Semiconductor package having molding layer with inclined side wallSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 9, 2024·4 cites·20 claims
- 0388US11393801B2Discrete decoupling capacitor and integrated circuit chip package including sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 19, 2022·4 cites·16 claims
- 0477US2024379478A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0576US10418335B2Substrate, method of sawing substrate, and semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 17, 2019·2 cites·15 claims
- 0675US12094794B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 17, 2024·0 cites·20 claims
- 0772US10916509B2Substrate, method of sawing substrate, and semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 9, 2021·1 cites·19 claims
- 0869US11515226B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
- 0957US2025174573A1Packaged semiconductor chips having protected identification marks thereinSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1056US2024178191A1Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1156US2024312823A1Method of splitting semiconductor chip using mechanical machining and semiconductor chip split by the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1253US10283846B2Electronic device including metal housing antennaSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 7, 2019·1 cites·20 claims
- 1353US2024321667A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1452US10932734B2Portable x-ray generation device having electric field emission x-ray sourceVATECH CO LTD·Filed 2016·Granted Mar 2, 2021·0 cites·10 claims
- 1550US10993679B2Portable x-ray generation device having electric field emission x-ray sourceVATECH CO LTD·Filed 2016·Granted May 4, 2021·0 cites·15 claims
Join the waitlist — get patent alerts
Get an alert when Seunghun Shin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →